Cypress CY8C22113 Manual De Usuario
June 3, 2004
Document No. 38-12009 Rev. *E
34
CY8C22x13 Final Data Sheet
4. Packaging Information
Figure 4-6. 32-Lead (5x5 mm) MLF
4.2
Thermal Impedances
4.3
Capacitance on Crystal Pins
Table 4-1. Thermal Impedances per Package
Package
Typical
θ
JA
*
8 PDIP
123
o
C/W
8 SOIC
185
o
C/W
20 PDIP
109
o
C/W
20 SSOP
117
o
C/W
20 SOIC
81
o
C/W
32 MLF
22
o
C/W
* T
J
= T
A
+ POWER x
θ
JA
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
8 PDIP
2.8 pF
8 SOIC
2.0 pF
20 PDIP
3.0 pF
20 SSOP
2.6 pF
20 SOIC
2.5 pF
32 MLF
2.0 pF
51-85188 - **
32
X = 138 MIL
Y = 138 MIL
Y = 138 MIL