Cypress CY7C1382D Manual De Usuario

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CY7C1380D, CY7C1382D
CY7C1380F, CY7C1382F
Document #: 38-05543 Rev. *F
Page 19 of 34
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. For user guidelines, not tested. 
Storage Temperature  ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on V
DD
 Relative to GND ........–0.3V to +4.6V
Supply Voltage on V
DDQ
 Relative to GND...... –0.3V to +V
DD
DC Voltage Applied to Outputs
in Tri-State ...........................................–0.5V to V
DDQ
 + 0.5V
DC Input Voltage ................................... –0.5V to V
DD
 + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage...........................................  >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.....................................................  >200 mA
Operating Range
Range
Ambient
Temperature
V
DD
V
DDQ
Commercial
0°C to +70°C  3.3V
 –5%/+10% 2.5V – 5%
to V
DD
Industrial
–40°C to +85°C 
Electrical Characteristics 
Over the Operating Range
Parameter
Description
Test Conditions
Min
Max
Unit
V
DD
Power Supply Voltage
3.135
3.6
V
V
DDQ
I/O Supply Voltage
for 3.3V I/O
3.135
V
DD
V
for 2.5V I/O
2.375
2.625
V
V
OH
Output HIGH Voltage
for 3.3V I/O, I
OH 
= –4.0 mA
2.4
V
for 2.5V I/O, I
OH 
= –1.0 mA
2.0
V
V
OL
Output LOW Voltage
for 3.3V I/O, I
OL 
= 8.0 mA
0.4
V
for 2.5V I/O, I
OL 
= 1.0 mA
0.4
V
V
IH
Input HIGH Voltage 
for 3.3V I/O
2.0
V
DD
 + 0.3V V
for 2.5V I/O
1.7
V
DD
 + 0.3V V
V
IL
Input LOW Voltage 
for 3.3V I/O
–0.3
0.8
V
for 2.5V I/O
–0.3
0.7
V
I
X
Input Leakage Current 
except ZZ and MODE
GND 
≤ V
I
 
≤ V
DDQ
–5
5
μA
Input Current of MODE
Input = V
SS
–30
μA
Input = V
DD
5
μA
Input Current of ZZ
Input = V
SS
–5
μA
Input = V
DD
30
μA
I
OZ
Output Leakage Current GND 
≤ V
I
 
≤ V
DDQ, 
Output Disabled
–5
5
μA
I
DD
V
DD
 Operating Supply 
Current
V
DD 
= Max., I
OUT 
= 0 mA,
f = f
MAX
 = 1/t
CYC
4.0-ns cycle, 250 MHz
350
mA
5.0-ns cycle, 200 MHz
300
mA
6.0-ns cycle, 167 MHz
275
mA
I
SB1
Automatic CE 
Power Down 
Current—TTL Inputs
V
DD 
= Max, Device Deselected, 
V
IN
 
≥ V
IH
 or V
IN
 
≤ V
IL
f = f
MAX
 = 1/t
CYC
4.0-ns cycle, 250 MHz
160
mA
5.0-ns cycle, 200 MHz
150
mA
6.0-ns cycle, 167 MHz
140
mA
I
SB2
Automatic CE Power 
Down Current-CMOS 
Inputs
V
DD 
= Max, Device Deselected, 
V
IN
≤ 0.3V or V
IN
 > V
DDQ
 – 0.3V, f = 0
All speeds
70
mA
I
SB3
Automatic CE 
Power Down 
Current—CMOS Inputs
V
DD 
= Max, Device Deselected, or 
V
IN
 
≤ 0.3V or V
IN
 > V
DDQ
 – 0.3V
f = f
MAX
 = 1/t
CYC
4.0-ns cycle, 250 MHz
135
mA
5.0-ns cycle, 200 MHz
130
mA
6.0-ns cycle, 167 MHz
125
mA
I
SB4
Automatic CE
Power Down 
Current—TTL Inputs
V
DD 
= Max, Device Deselected, 
V
IN
 
≥ V
IH
 or V
IN
 
≤ V
IL
, f = 0
All speeds
80
mA
Notes
17. Overshoot: V
IH
(AC) < V
DD
 +1.5V (pulse width less than t
CYC
/2), undershoot: V
IL
(AC) > –2V (pulse width less than t
CYC
/2).
18. TPower up: Assumes a linear ramp from 0v to V
DD
(min.) within 200 ms. During this time V
IH
 < V
DD
 and V
DDQ 
< V
DD
.