Cypress CY8C24994 Manual De Usuario
CY8C24094, CY8C24794
CY8C24894, CY8C24994
CY8C24894, CY8C24994
Document Number: 38-12018 Rev. *M
Page 41 of 47
11.1 Thermal Impedance
11.2 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 11-1. Thermal Impedance for the Package
Package
Typical
θ
JA
56 QFN
12.93
o
C/W
68 QFN
13.05
o
C/W
100 VFBGA
65
o
C/W
100 TQFP
51
o
C/W
Table 11-2. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature
Maximum Peak Temperature
56 QFN
240
o
C
260
o
C
68 QFN
240
o
C
260
o
C
100 VFBGA
240
o
C
260
o
C
Notes
15. T
J
= T
A
+ POWER x
θ
JA
16. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
17. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
17. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications