Cypress CY62146DV30 Manual De Usuario
CY62146DV30
Document #: 38-05339 Rev. *A
Page 4 of 11
Capacitance
(for all packages)
Parameter
Description
Test Conditions
Max.
Unit
C
IN
Input Capacitance
T
A
= 25°C, f = 1 MHz,
V
CC
= V
CC(typ)
10
pF
C
OUT
Output Capacitance
10
pF
Thermal Resistance
Parameter
Description
Test Conditions
BGA
TSOP II
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch, four-layer
printed circuit board
72
75.13
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.86
8.95
°C/W
AC Test Loads and Waveforms
Parameters
2.50V
3.0V
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
R
TH
8000
645
Ω
V
TH
1.20
1.75
V
Data Retention Characteristics
(Over the Operating Range)
Parameter
Description
Conditions
Min. Typ.
Max.
Unit
V
DR
V
CC
for Data Retention
1.5
V
I
CCDR
Data Retention Current
V
CC
= 1.5V
CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
L
9
µA
LL
6
t
CDR
Chip Deselect to Data Retention Time
0
ns
t
R
Operation Recovery Time
t
RC
ns
V
CC
V
CC
OUTPUT
R2
50 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
Equivalent to:
THÉ
VENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Data Retention Waveform
Notes:
9. Tested initially and after any design or process changes that may affect these parameters.
10. Test condition for the 45 ns part is a load capacitance of 30 pF.
11. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min.)
> 100
µs or stable at V
CC(min.)
> 100
µs.
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5 V
DATA RETENTION MODE
t
R
V
CC
CE