Cypress CY8C21234 Manual De Usuario
CY8C21634, CY8C21534
CY8C21434, CY8C21334, CY8C21234
Document Number: 38-12025 Rev. *O
Page 39 of 45
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 41. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature
Maximum Peak Temperature
16 SOIC
240
o
C
260
o
C
20 SSOP
240
o
C
260
o
C
28 SSOP
240
o
C
260
o
C
32 QFN
240
o
C
260
o
C
Notes
22. T
J
= T
A
+ Power x
θ
JA
23. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane
24. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
24. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.