Cypress CY8C24094 Manual De Usuario

Document Number: 38-12018 Rev. *M

Page 38 of 47

This section illustrates the package specification for the CY8C24x94 PSoC devices, along with the thermal impedance for the package

and solder reflow peak temperatures.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at 

http://www.cypress.com/design/MR10161

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001-12921 **