Cypress CY8C23433 Manual De Usuario
CY8C23433, CY8C23533
Document Number: 001-44369 Rev. *B
Page 35 of 37
Figure 20. 28-Pin (210-Mil) SSOP
Thermal Impedances
Capacitance on Crystal Pins
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
51-85079 *C
Table 38. Thermal Impedances by Package
Package
Typical
θ
JA
32 QFN
19.4°C/W
28 SSOP
95°C/W
Table 39. Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
32 QFN
2.0 pF
28 SSOP
2.8 pF
Table 40. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature
Maximum Peak Temperature
32 QFN
240°C
260°C
28 SSOP
240°C
260°C
Notes
22. T
J
= T
A
+ POWER x
θ
JA
.
23. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.