Cypress CY62137FV30 Manual De Usuario
CY62137FV30 MoBL
®
Document Number: 001-07141 Rev. *F
Page 4 of 12
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters
.
Parameter
Description
Test Conditions
VFBGA
TSOP II
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
(Junction to Ambient)
Still air, soldered on a 3 × 4.5 inch,
two layer printed circuit board
two layer printed circuit board
75
77
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
(Junction to Case)
10
13
°C/W
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveform
Parameters
2.5V (2.2V to 2.7V)
3.0V (2.7V to 3.6V)
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
R
TH
8000
645
Ω
V
TH
1.20
1.75
V
Data Retention Characteristics
Over the Operating Range
Parameter
Description
Conditions
Min
Typ
Max
Unit
V
DR
V
CC
for Data Retention
1.5
V
I
CCDR
Data Retention Current
V
CC
= 1.5V, CE > V
CC
- 0.2V,
V
IN
> V
CC
- 0.2V or V
IN
< 0.2V
Ind’l/Auto-A
4
μA
Auto-E
12
t
CDR
Chip Deselect to Data Retention Time
0
ns
t
R
Operation Recovery Time
t
RC
ns
Data Retention Waveform
Figure 4. Data Retention Waveform
V
CC
V
CC
OUTPUT
R2
30 pF
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
INCLUDING
JIG AND
SCOPE
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5V
DATA RETENTION MODE
t
R
V
CC
CE or
BHE.BLE
Notes
8. Tested initially and after any design or process changes that may affect these parameters.
9. Full device operation requires linear V
9. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100
μs or stable at V
CC(min)
> 100
μs.
10. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.