Intel 820E Manual De Usuario

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Intel
®
 820E Chipset 
 
 
 
 
R
 
66  
Design 
Guide 
Figure 37. Top Signal Layer 
 
Ground Reference 
It is strongly recommended that, at a minimum, the following critical signals be referenced to ground 
from the MCH to an AGP connector (or to an AGP video controller, if implemented as a “down” 
solution), utilizing a minimum number of vias on each net: AD_STB0, AD_STB0#, AD_STB1, 
AD_STB1#, SB_STB, SB_STB#, G_GTRY#, G_IRDY#, G_GNT#, and ST[2:0]. 
In addition to the minimum signal set listed previously, it is strongly recommended that half of all AGP 
signals be referenced to ground, depending on the board layout. In the ideal design, the entire AGP 
interface signal field would be referenced to ground. 
These recommendations are not specific to any particular PCB stack-up, but are applicable to all Intel
 
chipset designs. 
2.8.7. V
DDQ
 Generation and TYPEDET# 
AGP specifies two separate power planes (V
CC
 and V
DDQ
). V
CC
 is the core power for the graphics 
controller. V
CC
 is always 3.3 V. V
DDQ
 is the interface voltage. In AGP 1.0 implementations, V
DDQ
 was 
also 3.3 V. For the designer developing an AGP 1.0 motherboard, there is no distinction between V
CC
 
and V
DDQ
, because both are tied to the 3.3 V power plane on the motherboard. 
AGP 2.0 requires that these power planes be separate. In conjunction with the 4
×
 data rate, the AGP 2.0 
interface specification provides for low-voltage (1.5 V) operation. The AGP 2.0 specification 
implements a TYPEDET# (type detect) signal on the AGP connector that determines the operating 
voltage of the AGP 2.0 interface (V
DDQ
). The motherboard must provide either 1.5 V or 3.3 V to the 
add-in card, depending on the state of the TYPEDET# signal. (Refer to Table 12.) 1.5 V low-voltage 
operation applies only to the AGP interface (V
DDQ
). V
CC
 is always 3.3 V.