Compaq W4000 Manual De Usuario

Chapter 2  System Overview 

 

2.4.1  INTEL PENTIUM 4 PROCESSOR 

 
The models covered in this guide feature the Intel Pentium 4 processor. This processor is 
backward-compatible with software written for the Pentium III, Pentium II, Pentium MMX, 
Pentium Pro, Pentium, and x86 microprocessors. The processor architecture includes a floating-
point unit, 32-KB first and 512-KB secondary caches, and enhanced performance for multimedia 
applications through the use of multimedia extension (MMX) instructions. Also included are 
streaming SIMD extensions (SSE and SSE2) for enhancing 3D graphics and speech processing 
performance. The Pentium 4 processor features Net-Burst Architecture that uses hyper-pipelined 
technology and a rapid-execution engine that runs at twice the processor's core speed.  
 
These systems employ an mPGA478B zero-insertion-force (ZIF) socket designed for mounting a 
“Flip-Chip” (FC-PGA2) processor package (Figure 2-10). Small form factor units use a passive 
heat sink held in place over the FC-PGA package with two retaining clips. Desktop and 
configurable minitower units use an active assembly (which integrates the heat sink and fan) that 
clips on to the processor socket over the FC-PGA package. 
  
 
 
 
 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Figure 2–10.   Processor Assembly And Mounting 

FC-PGA2 Package 
(w/ Integrated Heat 
Spreader)

 

mPGA478B 
Socket

 

Lock/Unlock 

Handle 

(Shown in unlock position)

 

Heat Sink 

Retaining Clips

 

Heat Sink for 

Small Form Factor Units

 

Heat Sink / Fan Assembly for 
Desktop and 
Configurable Minitower Units

 

 
These systems support processors fitted with passive heat sinks or processors fitted with heat 
sink/fan assembly with a power cable that attaches to a fan-power header provided on the system 
board.  There are three types of passive heat sinks.  
 

NOTE: The two types of heat sinks are not interchangeable. Also, these systems support 
processors using the FC-PGA2 package only.  

 

 

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