Intel E1600 BX80557E1600 Manual De Usuario
Los códigos de productos
BX80557E1600
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
21
Electrical Specifications
2.10
Maximum Ratings
lists the processor’s maximum environmental stress ratings. The processor should not
receive a clock while subjected to these conditions. Functional operating parameters are listed in
the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability.
Furthermore, although the processor contains protective circuitry to resist damage from Electro
Static Discharge (ESD), one should always take precautions to avoid high static voltages or electric
fields.
the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability.
Furthermore, although the processor contains protective circuitry to resist damage from Electro
Static Discharge (ESD), one should always take precautions to avoid high static voltages or electric
fields.
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core silicon unless
noted otherwise. See
noted otherwise. See
for the pin signal definitions and signal pin assignments. Most of
the signals on the processor system bus are in the AGTL+ signal group. The DC specifications for
these signals are listed in
these signals are listed in
Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage
CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The
DC specifications for these signal groups are listed in
CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The
DC specifications for these signal groups are listed in
.
through
list the DC specifications for the Celeron processor on 0.13 micron
process and are valid only while meeting specifications for case temperature, clock frequency, and
input voltages. Care should be taken to read all notes associated with each parameter.
input voltages. Care should be taken to read all notes associated with each parameter.
2.11.1
Flexible Motherboard Guidelines (FMB)
The FMB guidelines are an estimation of the maximum value the Celeron processor on
0.13 micron process will have over a certain time period. The value is only an estimate, and actual
specifications for future processors may differ.
0.13 micron process will have over a certain time period. The value is only an estimate, and actual
specifications for future processors may differ.
Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V.
Processors with multiple VID have Icc_max of the highest VID for the specified frequency. For
example for the processors through 2.40 GHz, the Icc-max would be the one at VID=1.525 V.
Processors with multiple VID have Icc_max of the highest VID for the specified frequency. For
example for the processors through 2.40 GHz, the Icc-max would be the one at VID=1.525 V.
Table 6. Processor DC Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
T
STORAGE
Processor storage temperature
-40
85
°C
1
NOTES:
1.
Contact Intel for storage requirements in excess of one year.
VCC
Any processor supply voltage with respect to VSS
-0.3
1.75
V
2
2.
This rating applies to any processor pin.
V
inAGTL+
AGTL+ buffer DC input voltage with respect to
VSS
VSS
-0.1
1.75
V
V
inAsynch_GTL+
Asynch GTL+ buffer DC input voltage with
respect to VSS
respect to VSS
-0.1
1.75
V
I
VID
Max VID pin current
5
mA