Intel Desktop Board DG41RQ, 10-Pack BLKDG41RQ-1OPACK Manual De Usuario
Los códigos de productos
BLKDG41RQ-1OPACK
Technical Reference
57
2.5.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 28 lists the current capability of the fan headers.
Table 28. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
2.0 A
Rear chassis fan
1.5 A
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (both expansion
slots filled and the PCI Express x16 connector filled) must not exceed 8 A.
The total +5 V current draw for add-in boards for a fully loaded board (both expansion
slots filled and the PCI Express x16 connector filled) must not exceed 8 A.
2.6
Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.