Intel Xeon 7130N LF80550KF0878M Hoja De Datos
Los códigos de productos
LF80550KF0878M
Boxed Processor Specifications
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
105
solution limitations by using a load path attached to the chassis pan. The hat spring on the under
side of the baseboard provides the necessary compressive load for the thermal interface material.
The baseboard is intended to be isolated such that the dynamic loads from the heatsink are
transferred to the chassis pan via the heatsink screws and heatsink standoffs. This reduces the risk
of package pullout and solder joint failures in a shock and vibe situation.
side of the baseboard provides the necessary compressive load for the thermal interface material.
The baseboard is intended to be isolated such that the dynamic loads from the heatsink are
transferred to the chassis pan via the heatsink screws and heatsink standoffs. This reduces the risk
of package pullout and solder joint failures in a shock and vibe situation.
The assembly requires larger diameter holes to compensate for the CEK spring embosses. See
for processor mounting thorough holes.
8.3
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor will be cooled by forcing ducted chassis fan airflow through the passive
heatsink solution. Meeting the processor’s temperature specifications is a function of the thermal
design of the entire system, and ultimately the responsibility of the system integrator. The
processor temperature specification is found in
heatsink solution. Meeting the processor’s temperature specifications is a function of the thermal
design of the entire system, and ultimately the responsibility of the system integrator. The
processor temperature specification is found in
of this document. For the boxed
processor passive heatsink to operate properly, chassis air movement devices are required.
Necessary airflow and associated flow impedance is 29 cfm at 0.10” H
Necessary airflow and associated flow impedance is 29 cfm at 0.10” H
2
O.
In addition, the processor pitch should be 3.25 inches, or slightly more, when placed in side by side
orientation.
orientation.
illustrates the side by side orientation and pitch. Note that the heatsinks are
interleaved to reduce air bypass.
It is also recommended that the ambient air temperature outside of the chassis be kept at or below
35
35
°
C. The air passing directly over the processor heatsink should not be preheated by other
system components (such as another processor), and should be kept at or below 40
°
C. Again,
meeting the processor’s temperature specification is the responsibility of the system integrator.
8.3.2
Boxed Processor Contents
The boxed processor will include the following items:
•
Dual-Core Intel
®
Xeon
®
Processor 7000 Series
•
Unattached passive heatsink with captive screws
•
Thermal interface material (pre-attached)
•
Warranty/installation manual with Intel Inside logo
The other items required with this thermal solution should be shipped with either the chassis or the
mainboard. They include:
mainboard. They include:
•
CEK spring (typically included with mainboard)
•
Chassis standoffs
•
System fans
§