Intel Xeon 7130N LF80550KF0878M Hoja De Datos

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The upper point of the thermal profile consists of the Thermal Design Power (TDP) defined in 

 and the associated T

CASE

 value. The lower point of the thermal profile consists of x = 

P

CONTROL_BASE

 and y = T

CASE_MAX

 @ P

CONTROL_BASE

. Pcontrol is defined as the processor 

power at which T

CASE

, calculated from the thermal profile, corresponds to the lowest possible 

value of Tcontrol. This point is associated with the Tcontrol value (see 

) However, 

because Tcontrol represents a diode temperature, it is necessary to define the associated case 
temperature. This is T

CASE_MAX

 @ P

CONTROL_BASE

. Please see 

 and the Dual-Core 

 Processor 7000 Sequence Thermal/Mechanical Design Guidelines for proper usage 

of the Tcontrol specification.

The case temperature is defined at the geometric top center of the processor IHS. Analysis 
indicates that real applications are unlikely to cause the processor to consume maximum power 
dissipation for sustained time periods. Intel recommends that complete thermal solution designs 
target the TDP indicated in 

, instead of the maximum processor power consumption. The 

Thermal Monitor feature is intended to help protect the processor in the event that an application 
exceeds the TDP recommendation for a sustained time period. For more details on this feature, 
refer to 

. To ensure maximum flexibility for future requirements, systems should be 

designed to the FMB guidelines, even if a processor with a lower thermal dissipation is currently 
planned. Thermal Monitor must be enabled for the processor to remain within specification.

2.66 GHz - FMB

173

165

5

See 

 

1,

 

2,

 

3,

 

4

1. These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure the processor is not 

to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at specified I

CC

. Please refer to the V

CC

 

static and transient tolerance specifications in 

2. Maximum Power is the maximum thermal power that can be dissipated by the processor through the integrated heat spreader 

(IHS). Maximum Power is measured at maximum T

CASE

.

3. Thermal Design Power (TDP) should be used for processor/chipset thermal solution design targets. TDP is not the maximum 

power that the processor can dissipate. TDP is measured at maximum T

CASE

.

4. These specifications are based on final silicon characterization.