Intel Celeron 440 HH80557RG041512 Hoja De Datos

76

Datasheet

complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor power consumption. The Thermal Monitor 

feature is designed to protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained periods of time. For more details on 

. To ensure maximum flexibility for future 

requirements, systems should be designed to the 775_VR_CONFIG_06 guidelines, even 

if a processor with a lower thermal dissipation is currently planned. In all cases the 

Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to 

remain within specification.

1. Specification is at 35 °C T

C

 and typical voltage loadline.

2. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.

420

1.6

35.0

8

775_VR_CONFIG

_06

5

See 

, 

3, 4

3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power

that the processor can dissipate.

4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the

maximum T

C

 will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for

the allowed combinations of power and T

C

.

430

1.8

35.0

8

5

3, 4

440

2.0

35.0

8

5

3, 4

450

2.2

35.0

8

5

3, 4