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Thermal Specifications and Design Considerations
80
Datasheet
5.1.2
Thermal Metrology
The maximum and minimum case temperatures (T
C
) for the processor is specified in 
. This temperature specification is meant to help ensure proper operation of 
the processor. 
 illustrates where Intel recommends T
C
 thermal 
measurements should be made. For detailed guidelines on temperature measurement 
methodology, refer to the Yorkfield Processor Thermal and Mechanical Design 
Guidelines Addendum.
5.2
Processor Thermal Features
5.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the 
thermal control circuit (TCC) when the processor silicon reaches its maximum operating 
temperature. The TCC reduces processor power consumption by modulating (starting 
and stopping) the internal processor core clocks. The Thermal Monitor feature must 
be enabled for the processor to be operating within specifications. The 
temperature at which Thermal Monitor activates the thermal control circuit is not user 
configurable and is not software visible. Bus traffic is snooped in the normal manner, 
and interrupt requests are latched (and serviced during the time that the clocks are on) 
while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists 
(i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off 
and on at a duty cycle specific to the processor (typically 30-50%). Clocks often will not 
be off for more than 3.0 microseconds when the TCC is active. Cycle times are 
processor speed dependent and will decrease as processor core frequencies increase. A 
small amount of hysteresis has been included to prevent rapid active/inactive 
transitions of the TCC when the processor temperature is near its maximum operating 
temperature. Once the temperature has dropped below the maximum operating 
temperature, and the hysteresis timer has expired, the TCC goes inactive and clock 
modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the 
TCC would only be activated for very short periods of time when running the most 
power intensive applications. The processor performance impact due to these brief 
Figure 5-3. Case Temperature (T
C
) Measurement Location
 
37.5 mm 
Measure T
C
at this point            
(geometric center of the package)
3
7
.5
 m
m
 
37.5 mm 
Measure T
C
at this point            
(geometric center of the package)
3
7
.5
 m
m