Intel Mobile Intel Celeron RH80532NC049256 Hoja De Datos
Los códigos de productos
RH80532NC049256
Datasheet
33
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin
Information
4.1
Package Mechanical Specifications
The processor is available in a 1-MB, 478-pin Micro-FCPGA package. The package
mechanical dimensions, keep-out zones, processor mass specifications, and package
loading specifications are shown in
.
The SFF processor (ULV DC) is available 956-ball Micro-FCBGA packages. The package
mechanical dimensions are shown in Figure 7.
The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF Package
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This requirement is to protect the processor die from fracture risk due
to uneven die pressure distribution under tilt, stack-up tolerances and other similar
conditions. These specifications assume that a mechanical attach is designed
specifically to load one type of processor.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution. Please refer
to the Santa Rosa Platform Mechanical Design Guide for more details.
Note:
For M-step based processors refer to the 2-MB package drawings.