SMSC USB20H04 Manual De Usuario

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4-Port USB 2.0 Controller 
 
Datasheet 
SMSC USB20H04 
Page 35 
Revision 1.63 (03-30-07) 
 
DATASHEET
 
Chapter 11  Package Outline 
 
Figure 11.1 - 64 Pin TQFP Package Outline, 10 x 10 x 1.4 Body, 2 MM Footprint 
Table 11.1 - 64 Pin TQFP Package Parameters 
 MIN 
NOMINAL 
MAX
REMARKS 
1.60
Overall Package Height 
A1 
0.05 ~ 0.15
Standoff 
A2 
1.35 ~ 1.45
Body Thickness 
11.80 ~ 12.20
Span 
D1 
9.80 ~ 10.20
body Size 
11.80 ~ 12.20
Span 
E1 
9.80 ~ 10.20
body Size 
0.09 
0.20
Lead Frame Thickness 
0.45 
0.60 
0.75
Lead Foot Length 
L1 
~ 1.00 ~
Lead 
Length 
0.50 Basic 
Lead Pitch 
θ 
0
o
 ~ 7
o
Lead Foot Angle 
0.17 0.22 0.27
Lead 
Width 
R1 
0.08 
~
Lead Shoulder Radius 
R2 
0.08 
0.20
Lead Foot Radius 
ccc 
~ ~ 
0.08
Coplanarity 
Notes: 
1.  Controlling Unit: millimeter. 
2.  Tolerance on the true position of the leads is ± 0.04 mm maximum. 
3.  Package body dimensions D1 and E1 do not include the mold protrusion.  
Maximum mold protrusion is 0.25 mm per side. 
4.  Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane. 
5.  Details of pin 1 identifier are optional but must be located within the zone indicated.