Intel X5675 BX80614X5675 Manual De Usuario
Los códigos de productos
BX80614X5675
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
47
Electrical Specifications
2.7
Intel® QuickPath Interconnect Specifications
Intel
QuickPath Interconnect specifications are defined at the processor
pins. In most cases, termination resistors are not required as these are integrated into
the processor silicon (Refer to
the processor silicon (Refer to
).
Table 2-19. Common Intel® QuickPath Interconnect Specifications
Symbol
Parameter
Min
Nom
Max
Unit
Notes
UIavg
Avg UI size at “f” GT/s
(f = 4.8, 5.86, or 6.4)
0.999 *
Nom
1000/f
1.001 *
Nom
psec
T
slew-rise-fall-pin
Defined as the slope of the rising or
falling waveform as measured between
+/- 100 mV of the differential transmitter
output, for any data or clock.
10
25
V / nsec
Z
TX_LOW_CM_DC
DC resistance of Tx terminations at half
the single ended swing (usually
0.25*V
Tx-diff-pp-pin
) bias point
38
52
Z
TX_LOW_CM_DC
Defined as: (max(Z
TX_LOW_CM_DC
) -
min(Z
TX_LOW_CM_DC
))
/ Z
TX_LOW_CM_DC
expressed in %, over full range of Tx
single ended voltage
-6
0
6
% of
Z
TX_LOW_CM_DC
Z
RX_LOW_CM_DC
DC resistance of Rx terminations at half
the single ended swing (usually
0.25*V
Tx-diff-pp-pin
) bias point
38
52
Z
RX_LOW_CM_DC
Defined as: (max(Z
RX_LOW_CM_DC
) -
min(Z
RX_LOW_CM_DC
))
/ Z
RX_LOW_CM_DC
expressed in %, over full range of Rx
single ended voltage
-6
0
6
% of
Z
RX_LOW_CM_DC
N
MIN-UI-Validation
# of UI over which the eye mask voltage
and timing spec needs to be validated
1,000,000
UI
Z
TX_HIGH_CM_DC
Single ended DC impedance to GND for
either D+ or D- of any data bit at Tx
10k
1
Z
RX_HIGH_CM_DC
Single ended DC impedance to GND for
either D+ or D- of any data bit at Rx
10k
2
Z
TX_LINK_DETECT
Link Detection Resistor
500
2000
V
TX_LINK_DETECT
Link Detection Resistor Pull-up Voltage
1.6
V
T
DATA_TERM_SKEW
Skew between first to last data
termination meeting Z
RX_LOW_CM_DC
128
UI
T
INBAND_RESET_SENSE
Time taken by inband reset detector to
sense Inband Reset
1.5
µs
T
CLK_DET
Time taken by clock detector to observe
clock stability
20k
UI
T
CLK_FREQ_DET
Time taken by clock frequency detector
to decide slow vs. operational clock after
stable clock
32
Reference
Clock Cycles
T
Refclk-Tx-Variability
Phase variability between Reference Clk
(at Tx input) and Tx output
500
psec
T
Refclk-jitter-rms-onepll
Accumulated rms jitter over n UI of a
given PLL model output in response to
the jittery reference clock input. The PLL
output is generated by convolving the
measured reference clock phase jitter
with a given PLL transfer function. Here
n=12.
0.5
psec
BER
Lane
Bit Error Rate per lane valid for 4.8, 5.86
and 6.4 GT/s
1.0E-14
Events
QPI[1,0]_COMP
COMP Resistance
21.0-1%
21.0
21.0+1%