Senstech Sdn. Bhd. MD-H01 Manual De Usuario

16／17

11.2 List of components

MMRW-MD-H01

Part Name

Specification

Qty

Part No.

L-MOS

1 U1

〃

1 U2

〃

1 U3

RF Power Detector

1 U4

Dual Operatinal Amplifier

2 U5,6

Comparator

1 U7

MCU

16KB

1 U8

Chip Resistor

1608 0Ω

2 R1,3

〃

1608 15Ω

1 R2

〃

1608 33Ω

2 R28,29

〃

1608 150Ω

2 R8,9

〃

1608 180Ω

2 R22,25

〃

1608 330Ω

2 R23,24

〃

1608 1KΩ

12 R5,7,10,12,13,16,17,18,19,

R21,26,27

〃

1608 3KΩ

1 R30

〃

1608 4.3KΩ

1 R14

〃

1608 5.1KΩ

1 R11

〃

1608 10KΩ

1 R4

〃

1608 22KΩ

1 R15

〃

1608 47KΩ

1 R20

〃

1608 1MΩ

1 R6

Chip Capacitor

1608 12pF

2 C24,25

〃

1608 82pF

2 C11,12

〃

1608 100pF

1 C4

〃

1608 220pF

2 C5,C13

〃

1608 560pF

1 C26

〃

1608 2200pF

1 C16

〃

1608 0.1μF

6 C6,8,9,20,21,22

〃

1608 1μF

5 C10,14,15,17,19

〃

1608 4.7μF

2 C7,18

Chip Tantalum Capacitor

6.3V 10μF

1 C23

Chip Coil

1608 130nH

2 L2,3

〃

1680 470nH

1 L1

〃

1608 1μH

2 L4,5

Transistor

Surface Mount

1 Q1

Diode

Surface Mount

2 D1,2

LED

Surface Mount

2 LED1,2

Crystal Oscillator

13.56MHz

1 X1

Connector

Surface Mount

1 CN2

〃

Surface Mount

1 CN3

Mini USB Connector

Surface Mount

1 CN4

R/F Substrate(Two-Layered)

45 x 33 x 1mm

1

S/No. Sticker

26 x 12.5mm

1 (Figure No.: D07011N-D1)