HP BL620c G7 W CTO 643786-B21 Hoja De Datos
Los códigos de productos
643786-B21
3
HP ProLiant BL620c G7 Server Blade
Advanced memory protection
• HP Memory Quarantine (based on Intel MCA Recovery)
• Double Device Data Correction (DDDC)
• Single Device Data Correction (SDDC)
• Demand and Patrol Scrubbing
• Intra-socket Memory Mirroring
• Memory Failover
• Double Device Data Correction (DDDC)
• Single Device Data Correction (SDDC)
• Demand and Patrol Scrubbing
• Intra-socket Memory Mirroring
• Memory Failover
• Rank Sparring (Online Spare)
• Failed DIMM Isolation
• DIMM Address/Control Bus Parity Protection
• Data Bus ECC protection
• Advanced ECC
• Intel SMI Clock Fail Over
• Intel SMI Packet Retry
• Failed DIMM Isolation
• DIMM Address/Control Bus Parity Protection
• Data Bus ECC protection
• Advanced ECC
• Intel SMI Clock Fail Over
• Intel SMI Packet Retry
Networking and I/O
Integrated network adapter
• Four HP embedded 10 Gb NC553i FlexFabric Converged Network Adapter ports connected to a redundant I/O fabric
I/O expansion slots
• Three PCIe Gen2 connected to three redundant I/O fabrics
Standard/maximum I/O bandwidth
• 40 Gb/96 Gb
Networking options
• Multiple, redundant port 10 Gb FlexFabric, 10GbE Flex-10, 10 Gb and 1 Gb Ethernet, and 4X QDR (40 Gb) InfiniBand
Storage
Storage type
• Hot-plug SFF SAS
• Hot-plug SFF SATA
• Hot-plug SFF SSD
• Hot-plug SFF SATA
• Hot-plug SFF SSD
Maximum internal storage
• Two hot-plug SAS/SATA/SSD bays supporting up to 2.0 TB
Integrated storage controller
• 6 Gb Smart Array P410i Controller with RAID 0 and 1 with optional FBWC options to 1 GB
Storage options
• 4 Gb and 8 Gb Fibre Channel mezzanine adapters (Brocade, Emulex, and QLogic options)
• Smart Array Controller mezzanines options with BBWC or FBWC to 1 GB for connection to external direct-attached or shared
• Smart Array Controller mezzanines options with BBWC or FBWC to 1 GB for connection to external direct-attached or shared
storage
• I/O accelerator cards for high-performance I/O
• HP Storage Ultrium Tape Blades for an integrated direct-attached data protection solution
• Optional HP Storage Ultrium Tape Blades
• Optional D2200sb PCIe Storage Blades for direct-attached and shared storage within the c-Class enclosures
• Compatible with HP Storage MSA, EVA, and select third-party SANs
• HP Storage Ultrium Tape Blades for an integrated direct-attached data protection solution
• Optional HP Storage Ultrium Tape Blades
• Optional D2200sb PCIe Storage Blades for direct-attached and shared storage within the c-Class enclosures
• Compatible with HP Storage MSA, EVA, and select third-party SANs
Flash media
• Internal USB 2.0 port
• Internal microSDHC slot
• Internal microSDHC slot
Deployment
Form factor
• Full-height, single, wide server blade
• Eight server blades per c7000 10U enclosure
• Four server blades per c3000 6U enclosure
• Eight server blades per c7000 10U enclosure
• Four server blades per c3000 6U enclosure
System management
• HP Integrated Lights-Out 3
• HP Insight Foundation
• BladeSystem enclosure Onboard Administrator (OA) with KVM (optional redundant OA)
• HP Insight Control (optional)
• HP Insight Dynamics for ProLiant (optional)
• HP Insight Foundation
• BladeSystem enclosure Onboard Administrator (OA) with KVM (optional redundant OA)
• HP Insight Control (optional)
• HP Insight Dynamics for ProLiant (optional)
Other
Power and fans
• True N+N redundant hot-plug, high-efficiency,
enclosure-based power supplies
• Redundant hot-plug HP Active Cool fans
• HP Thermal Logic Technology/Sea of Sensors
• HP Dynamic Power Saver Mode
• HP Power Regulator
• Parallel Redundant Scalable Enclosure Cooling (PARSEC)
• HP Thermal Logic Technology/Sea of Sensors
• HP Dynamic Power Saver Mode
• HP Power Regulator
• Parallel Redundant Scalable Enclosure Cooling (PARSEC)
design
• Power workload balancing
• Enclosure-based HP Dynamic Power Capping
• Enclosure-based common power supply form factor
• Lower power Intel Model 7510 Scalable Memory Buffer
• Intel intelligent power technology, lower partial active and
• Enclosure-based HP Dynamic Power Capping
• Enclosure-based common power supply form factor
• Lower power Intel Model 7510 Scalable Memory Buffer
• Intel intelligent power technology, lower partial active and
lower idle power
• Low voltage DDR3 RDIMMs (LVDIMM)
RAS
• Nearly forty system-wide reliability, availability, and serviceability features
Security
• Trusted Platform Module 1.2 option
• Intel AES-NI
• Power-on password
• Administrator password
• iLO 3 with 12 customizable user accounts
• SSL encryption SSH v2
• AES and Triple Data Encryption Standard on browser
• CLP and XML scripting interface
• AES and RC4 encryption of video
• Intel AES-NI
• Power-on password
• Administrator password
• iLO 3 with 12 customizable user accounts
• SSL encryption SSH v2
• AES and Triple Data Encryption Standard on browser
• CLP and XML scripting interface
• AES and RC4 encryption of video
• Global disable setting
• Keyboard password
• External USB port enable/disable
• Network server mode
• Serial interface control
• Onboard Administrator user accounts with defined user
• Keyboard password
• External USB port enable/disable
• Network server mode
• Serial interface control
• Onboard Administrator user accounts with defined user
privilege levels
• Onboard Administrator Lightweight Directory Access Protocol
authentication for user accounts
Warranty
• 3-year parts/3-year labor/3-year onsite
For additional technical specifications, please visit:
Technical specifications (Contd.)