Checkpoint Systems Inc. EVOLVES10 Manual De Usuario

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Chapter 1 – Universal Socket Connectivity 
Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342D) 
13 
 
Design Considerations 
Good engineering practices must be adhered to when designing a printed circuit board (PCB) containing the 
SocketModem module. Suppression of noise is essential to the proper operation and performance of the modem 
itself and for surrounding equipment. 
Two aspects of noise in an OEM board design containing the SocketModem must be considered: on-board/off-board 
generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled 
on-board can affect interface signal levels and quality. Of particular concern is noise in frequency ranges affecting 
modem performance. 
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a 
separate, but equally important, concern. This type of noise can affect the operation of surrounding equipment. Most 
local government agencies have stringent certification requirements that must be met for use in specific 
environments. 
Proper PC board layout (component placement, signal routing, trace thickness and geometry, etc.) component 
selection (composition, value, and tolerance), interface connections, and shielding are required for the board design 
to achieve desired modem performance and to attain EMI certification. 
The aspects of proper engineering practices are beyond the scope of this designer guide. The designer should 
consult noise suppression techniques described in technical publications and journals, electronics and electrical 
engineering text books, and component supplier application notes. 
PC Board Layout Guidelines 
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and 
ground are typically on the inner layers. All power and ground traces should be 0.05 inches wide. 
The recommended hole size for the SocketModem pins is 0.036 in. +/-0.003 in. in diameter. Spacers can be 
used to hold the SocketModem vertically in place during the wave solder process. A spacer should be placed on 
pin 32 and pin 64 of the SocketModem. A suggested part number for the spacer is BIVAR 938-0.130 for P1 
(0.310in) option SocketModems. The spacers can be left on permanently and will not effect operation. 
All creepages and clearances for the SocketModem have been designed to meet requirements of safety 
standards EN60950. The requirements are based on a working voltage of 250V. When the recommended DAA 
circuit interface is implemented in a third party design all creepage and clearance requirements must be strictly 
adhered to. The third party safety design must be evaluated by the appropriate national agency per the required 
specification. 
User accessible areas: Based on where the third party design is to be marketed, sold, or used, it may be 
necessary to provide an insulating cover over all TNV exposed areas. Consult with the recognized safety agency 
to determine the requirements. 
Note:
  Even if the recommended design considerations are followed, there are no guarantees that a particular 
system will comply with all the necessary regulatory requirements. It is imperative that specific designs be 
completely evaluated by a qualified/recognized agency.