MICROCHIP TECHNOLOGY INC. BM57SPPSYC2A Manual De Usuario
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp.
2
Content
1.
Introduction ...................................................................................................................... 3
1.1.
Major Components ....................................................................................................................................... 3
1.2.
Features ........................................................................................................................................................ 3
1.3.
Application .................................................................................................................................................... 4
1.4.
Certifications ................................................................................................................................................. 4
2.
Product Specification ...................................................................................................... 5
2.1.
Chipset .......................................................................................................................................................... 5
2.2.
Interfaces ...................................................................................................................................................... 5
2.3.
Hardware Design Considerations ................................................................................................................. 5
3.
Hardware Architecture ................................................................................................... 10
4.
Compatibility Requirements .......................................................................................... 10
5.
Environmental Requirements ....................................................................................... 11
5.1.
Temperature ............................................................................................................................................... 11
5.2.
Humidity ...................................................................................................................................................... 11
Appendix A: Dimension and Foot Print ................................................................................. 12
Appendix B: Product Image .................................................................................................... 13
Appendix C: PIN Assignment ................................................................................................. 14
Appendix D: Reflow Profile ..................................................................................................... 16
Appendix E: Schematic ........................................................................................................... 17
Appendix F: Reference Schematic ......................................................................................... 18
Appendix G: Test Board Layout Information ......................................................................... 19
Appendix H: Test Board Layout Information ......................................................................... 19
Appendix H: Label Information ............................................................................................... 19
Appendix I: Packaging Information ........................................................................................ 20
Appendix I: Reversion History ................................................................................................ 21