HP 460c Gen8 670657-S01 Manual De Usuario
Los códigos de productos
670657-S01
Security
Security
Security
Security
Power-on password
Administrator's password
Keyboard password (QuickLock)
HP iLO 4 On System Management Chipset with:
Administrator's password
Keyboard password (QuickLock)
HP iLO 4 On System Management Chipset with:
SSL encryption
Secure Shell version 2
Advanced Encryption Standard (AES) and Triple Data Encryption Standard (3DES) on
browser, CLP and XML scripting interface
AES and RC4 encryption of video
Secure Shell version 2
Advanced Encryption Standard (AES) and Triple Data Encryption Standard (3DES) on
browser, CLP and XML scripting interface
AES and RC4 encryption of video
External USB port enable/disable
Network server mode
Serial interface control
TPM (Trusted Platform Module) 1.2 option
Advanced Encryption Standard (AES)
Intel® Advanced Encryption Standard-New Instructions (AES-NI)
Network server mode
Serial interface control
TPM (Trusted Platform Module) 1.2 option
Advanced Encryption Standard (AES)
Intel® Advanced Encryption Standard-New Instructions (AES-NI)
Availability
Availability
Availability
Availability
Memory
Memory
Memory
Memory
Advanced ECC uses single device data correction (SDDC) to detect and correct single and all
multi-bit error that occurs within a single DRAM chip. Both x4 and x8 SDDC are supported (x8
requires lockstep mode).
Memory online spare mode (also known as rank spare mode) detects a rank that is degrading and
switches operation to the spare rank.
Memory Lockstep mode is used to correct a single x8 DRAM device failure on a DIMM. The
DIMMs in each paired memory channel must have identical HP part numbers.
Memory demand and patrol scrubbing to prevent accumulation of correctable errors and
reducing the likelihood of unplanned downtime.
Failed DIMM isolation improves the service time thus improving the overall system availability.
Address parity protection available on RDIMMs and LRDIMMs detects address bit errors to
improve service time and overall system availability.
multi-bit error that occurs within a single DRAM chip. Both x4 and x8 SDDC are supported (x8
requires lockstep mode).
Memory online spare mode (also known as rank spare mode) detects a rank that is degrading and
switches operation to the spare rank.
Memory Lockstep mode is used to correct a single x8 DRAM device failure on a DIMM. The
DIMMs in each paired memory channel must have identical HP part numbers.
Memory demand and patrol scrubbing to prevent accumulation of correctable errors and
reducing the likelihood of unplanned downtime.
Failed DIMM isolation improves the service time thus improving the overall system availability.
Address parity protection available on RDIMMs and LRDIMMs detects address bit errors to
improve service time and overall system availability.
Mezzanine options and I/O
Mezzanine options and I/O
Mezzanine options and I/O
Mezzanine options and I/O
" FlexibleLOM (LAN on Motherboard) connector supporting two (i.e. redundant) Ethernet ports.
Multiple mezzanine I/O expansion slots that support a wide variety of mezzanine cards each
supporting multiple data paths routed to redundant interconnect modules.
Network Adapter Teaming (bonding) provides network fault tolerance, transmit load balancing,
and switch-assisted load balancing.
Multiple mezzanine I/O expansion slots that support a wide variety of mezzanine cards each
supporting multiple data paths routed to redundant interconnect modules.
Network Adapter Teaming (bonding) provides network fault tolerance, transmit load balancing,
and switch-assisted load balancing.
Storage
Storage
Storage
Storage
Two (2) hot-plug SAS/SATA/SSD drive bays.
Integrated HP Smart Array P220i Controller with 512MB FBWC, RAID 0 and 1 support, and
upgradeable firmware with recovery ROM capability.
Optional HP D2200sb Storage Blade for direct attachment of up to 12 drives to an adjacent
blade within the c-Class enclosure.
Optional dual-port Fibre Channel mezzanine card(s) for redundant SAN connections.
Integrated HP Smart Array P220i Controller with 512MB FBWC, RAID 0 and 1 support, and
upgradeable firmware with recovery ROM capability.
Optional HP D2200sb Storage Blade for direct attachment of up to 12 drives to an adjacent
blade within the c-Class enclosure.
Optional dual-port Fibre Channel mezzanine card(s) for redundant SAN connections.
Processor/Chipset
Processor/Chipset
Processor/Chipset
Processor/Chipset
Processor internal sensors & thermal control protection against over-temperature conditions.
Cache parity/ECC protects cache data from accidental data corruption.
Cache parity/ECC protects cache data from accidental data corruption.
QuickSpecs
HP ProLiant BL460c Generation 8 (Gen8) Server Blade
HP ProLiant BL460c Generation 8 (Gen8) Server Blade
HP ProLiant BL460c Generation 8 (Gen8) Server Blade
HP ProLiant BL460c Generation 8 (Gen8) Server Blade
Standard Features
DA - 14208 North America — Version 5 — March 26, 2012
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