Intel Z520PT CH80566EE014DT Hoja De Datos

Intel

Los códigos de productos

CH80566EE014DT

Datasheet

3

Contents

Introduction ...................................................................................................... 7

Abstract ................................................................................................. 7

Major Features ....................................................................................... 7

Terminology ........................................................................................... 9

References ............................................................................................ 11

Low Power Features .......................................................................................... 13

Clock Control and Low-Power States ........................................................ 13

Package/Core Low-Power State Descriptions ................................ 15

Dynamic Cache Sizing ............................................................................ 22

Enhanced Intel SpeedStep® Technology ................................................... 23

Enhanced Low-Power States .................................................................... 24

FSB Low Power Enhancements................................................................. 25

CMOS Front Side Bus ................................................................ 25

Intel® Burst Performance Technology (Intel® BPT) .................................. 26

Electrical Specifications ..................................................................................... 27

FSB, GTLREF, and CMREF ........................................................................ 27

Power and Ground Pins ........................................................................... 27

Decoupling Guidelines ............................................................................ 28

Decoupling ......................................................................... 28

FSB AGTL+ Decoupling .............................................................. 28

FSB Clock (BCLK[1:0]) and Processor Clocking .......................................... 28

Voltage Identification and Power Sequencing ............................................. 28

Catastrophic Thermal Protection .............................................................. 31

Reserved and Unused Pins ...................................................................... 31

FSB Frequency Select Signals (BSEL[2:0]) ................................................ 31

FSB Signal Groups ................................................................................. 31

CMOS Asynchronous Signals ................................................................... 33

Maximum Ratings .................................................................................. 33

Processor DC Specifications ..................................................................... 34

AGTL+ FSB Specifications ....................................................................... 45

Package Mechanical Specifications and Pin Information.......................................... 47

Package Mechanical Specifications ........................................................... 47

Processor Package Weight ......................................................... 47

Processor Pinout Assignment ................................................................... 49

Signal Description .................................................................................. 56

Thermal Specifications and Design Considerations ................................................ 65

Thermal Specifications ............................................................................ 68

Thermal Diode ......................................................................... 68

Intel® Thermal Monitor ............................................................. 70

Digital Thermal Sensor .............................................................. 72