Intel G550 CM8062307261218 Manual De Usuario
Los códigos de productos
CM8062307261218
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
53
Package Mechanical Specifications
shows the keep-in specification for pin-side components. The Celeron processor on
0.13 micron process may contain pin side capacitors mounted to the processor package.
shows the flatness and tilt specifications for the IHS. Tilt is measured with the reference
datum set to the bottom of the processor substrate.
NOTES:
1. Pin plating consists of 0.2 micrometers Au over 2.0 micrometer Ni.
2. 0.254 mm diametric true position, pin-to-pin.
2. 0.254 mm diametric true position, pin-to-pin.
Figure 29. Processor Cross-Section and Keep-In
Figure 30. Processor Pin Detail
13.97m m
1.25m m
IHS
FCPGA
Com ponent Keepin
Socket m ust allow clearance
for pin shoulders and m ate
flush with this surface
Substrate
13.97m m
1.25m m
IHS
FCPGA
Com ponent Keepin
Socket m ust allow clearance
for pin shoulders and m ate
flush with this surface
Substrate
2
PINHEAD DIAMETER
Ø 0.65 MAX
KEEP OUT ZONE
Ø 1.032 MAX
2.03±0.08
SOLDER FILLET HEIGHT
0.3 MAX
ALL DIMENSIONS ARE IN MILIMETERS
Ø 0.305±0.025