HP BLc3000 696909-B21 Manual De Usuario
Los códigos de productos
696909-B21
HP BladeSystem c-Class
c3000 Enclosure
c3000 Enclosure
A BladeSystem c3000 enclosure holds up to 8 server blades and up to 4 expansion blades (not exceeding 8
total blades) plus redundant or non-redundant network and storage interconnects. It includes a shared,
multi-terabit high-speed mid-plane for wire-once connectivity of server blades to network and shared
storage. Power is delivered through a pooled power backplane that ensures the full capacity of the power
supplies is available to all blades.
total blades) plus redundant or non-redundant network and storage interconnects. It includes a shared,
multi-terabit high-speed mid-plane for wire-once connectivity of server blades to network and shared
storage. Power is delivered through a pooled power backplane that ensures the full capacity of the power
supplies is available to all blades.
Each c3000 enclosure is built with the following functions:
Up to 8 half-height, 4 full-height server blades and/or 4 expansion blades per enclosure.
NOTE: For information on mixing half-height server blades, full-height server blades, and expansion
blades, please see the section titled "Server Blade, Expansion Blade, and Fan Population Guidelines"
later in this document.
blades, please see the section titled "Server Blade, Expansion Blade, and Fan Population Guidelines"
later in this document.
Up to 3 redundant interconnect fabrics (Ethernet, FC, iSCSI, SAS, etc.) supported simultaneously
within the enclosure.
A single-phase power subsystem for flexibility in connecting to datacenter power, or to UPS's or to
low-line wall outlets.
Choice of AC or DC power supplies.
PARSEC enclosure design - Parallel, redundant and scalable cooling and airflow design.
Up to six (6) Active Cool fans
Fully redundant design providing no single point of failure; redundant interconnections between
servers and interconnect modules; a mid-plane with no active components; redundant cooling using
Active Cool fans.
Best performance per watt - lower wattage per server blade, in comparison to rack-mounted
servers
Full AC redundancy with no power zones.
Single or dual Onboard Administrator management modules
within the enclosure.
A single-phase power subsystem for flexibility in connecting to datacenter power, or to UPS's or to
low-line wall outlets.
Choice of AC or DC power supplies.
PARSEC enclosure design - Parallel, redundant and scalable cooling and airflow design.
Up to six (6) Active Cool fans
Fully redundant design providing no single point of failure; redundant interconnections between
servers and interconnect modules; a mid-plane with no active components; redundant cooling using
Active Cool fans.
Best performance per watt - lower wattage per server blade, in comparison to rack-mounted
servers
Full AC redundancy with no power zones.
Single or dual Onboard Administrator management modules
An Onboard Administrator management module is built in to the enclosure with the following functions:
Robust, multiple enclosure setup and control.
Reports asset and inventory information for the devices in the enclosure.
Reports thermal and power information, including real-time actual power usage per server and per
enclosure.
Front-mounted Insight Display for easy management at the deployment site.
Integrated access to all server blade iLOs from a single cable.
Provides integrated access to interconnect bay device management ports from the single Onboard
Administrator cable.
Single sign-on capability for all devices in the enclosure
Role-based security locally and/or with LDAP directory services.
Provides a wizard-based initial setup process for easy configuration.
An optional DVD drive for local software deployment, and HP SmartStart deployment
An optional local KVM interface for connection to KVM switches.
Reports asset and inventory information for the devices in the enclosure.
Reports thermal and power information, including real-time actual power usage per server and per
enclosure.
Front-mounted Insight Display for easy management at the deployment site.
Integrated access to all server blade iLOs from a single cable.
Provides integrated access to interconnect bay device management ports from the single Onboard
Administrator cable.
Single sign-on capability for all devices in the enclosure
Role-based security locally and/or with LDAP directory services.
Provides a wizard-based initial setup process for easy configuration.
An optional DVD drive for local software deployment, and HP SmartStart deployment
An optional local KVM interface for connection to KVM switches.
A BladeSystem c3000 enclosure provides the following benefits:
With local and remote hardware management integrated across the solution, one full enclosure can
be managed as easily as one server.
Scalable: Management and network interconnects extend scalability beyond a single enclosure,
allowing resources to be pooled and shared across multiple enclosures.
Investment protection: Accommodates multiple server and network designs in one enclosure.
Lower costs per server, in comparison to rack-mounted servers
be managed as easily as one server.
Scalable: Management and network interconnects extend scalability beyond a single enclosure,
allowing resources to be pooled and shared across multiple enclosures.
Investment protection: Accommodates multiple server and network designs in one enclosure.
Lower costs per server, in comparison to rack-mounted servers
QuickSpecs
HP BladeSystem c3000 Enclosure
HP BladeSystem c-Class Overview
DA - 12790 Worldwide — Version 56 — February 18, 2014
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