Intel Celeron 360 HH80552RE099512 Manual De Usuario
Los códigos de productos
HH80552RE099512
Datasheet
93
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by
the boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is in
. The boxed processor fan heatsink is able to
) in chassis that
provide good thermal management. For the boxed processor fan heatsink to operate
properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow
of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace
is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life.
illustrate an acceptable airspace clearance
for the fan heatsink. The air temperature entering the fan should be kept below 38 °C.
A Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the 38
°C requirement. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Note:
The processor fan is the primary source of airflow for cooling the V
CC
voltage regulator.
Dedicated voltage regulator cooling components may be necessary if the selected fan is
not capable of keeping regulator components below maximum rated temperatures.
Figure 21.
Baseboard Power Header Placement Relative to Processor Socket
B
C
R110
[4.33]