Acer Intel Xeon X5550 KC.55501.EPX Manual De Usuario

Los códigos de productos

KC.55501.EPX

Intel

Xeon

Processor 5500 Series Datasheet, Volume 1

6.3.3

Multi-Domain Commands....................................................................... 125

6.3.4

Client Responses .................................................................................. 125

6.3.5

Originator Responses ............................................................................ 126

6.3.6

Temperature Data ................................................................................ 127

6.3.7

Client Management ............................................................................... 128

Features ................................................................................................................ 131
7.1

Power-On Configuration (POC)........................................................................... 131

7.2

Clock Control and Low Power States................................................................... 132
7.2.1

Thread and Core Power State Descriptions ............................................... 133

7.2.2

Package Power State Descriptions ........................................................... 134

7.2.3

Intel® Xeon® Processor 5500 Series C-State Power Specifications.............. 135

7.3

Sleep States ................................................................................................... 136

7.4

Intel

Turbo Boost Technology .......................................................................... 136

7.5

Enhanced Intel SpeedStep

Technology ............................................................. 136

Boxed Processor Specifications.............................................................................. 137
8.1

Introduction.................................................................................................... 137
8.1.1

Available Boxed Thermal Solution Configurations ...................................... 137

8.1.2

An Intel “Combo” Boxed Passive / Active Combination Heat Sink Solution..... 137

8.1.3

Intel Boxed “Active” Heat Sink Solution ................................................... 138

8.1.4

Intel Boxed 25.5mm Tall Passive Heat Sink Solution.................................. 139

8.2

Mechanical Specifications.................................................................................. 140
8.2.1

Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 140

8.2.2

Boxed Processor Retention Mechanism and Heat Sink

Support (URS)...................................................................................... 149

8.3

Fan Power Supply (“Combo” and “Active” Solution) .............................................. 150
8.3.1

Boxed Processor Cooling Requirements.................................................... 151

8.4

Boxed Processor Contents................................................................................. 153