Acer Intel Xeon X5550 KC.55501.EPX Manual De Usuario

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KC.55501.EPX
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Package Mechanical Specifications
44
Intel
®
 Xeon
®
 Processor 5500 Series Datasheet, Volume 1
3.1.1
Package Mechanical Drawing
The package mechanical drawings are shown in 
. The 
drawings include dimensions necessary to design a thermal solution for the processor. 
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm. 
7. Guidelines on potential IHS flatness variation with socket load plate actuation and 
installation of the cooling solution is available in the TMDG.