Intel Quad-core Intel Xeon DP L5335 Passive BX80563L5335P Hoja De Datos
Los códigos de productos
BX80563L5335P
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
3
Contents
Introduction............................................................................................................... 11
1.1
1.1
Terminology ..................................................................................................... 13
Electrical Specifications ............................................................................................... 17
2.1
2.1
Front Side Bus and GTLREF ................................................................................ 17
Power and Ground Lands.................................................................................... 18
Decoupling Guidelines........................................................................................ 18
2.3.1
2.3.1
Decoupling...................................................................................... 18
Decoupling ...................................................................................... 18
Front Side Bus AGTL+ Decoupling ............................................................ 19
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 19
2.4.1
2.4.1
Voltage Identification (VID) ................................................................................ 21
Reserved, Unused, or Test Signals....................................................................... 23
Front Side Bus Signal Groups.............................................................................. 24
CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 26
Test Access Port (TAP) Connection....................................................................... 26
2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 26
2.10.1 DC Characteristics .................................................................................. 26
2.10.2 Input Device Hysteresis .......................................................................... 27
2.10.2 Input Device Hysteresis .......................................................................... 27
2.11 Mixing Processors.............................................................................................. 27
2.12 Absolute Maximum and Minimum Ratings ............................................................. 28
2.13 Processor DC Specifications ................................................................................ 29
2.12 Absolute Maximum and Minimum Ratings ............................................................. 28
2.13 Processor DC Specifications ................................................................................ 29
2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 29
2.13.2 VCC Overshoot Specification .................................................................... 42
2.13.3 Die Voltage Validation ............................................................................. 43
2.13.2 VCC Overshoot Specification .................................................................... 42
2.13.3 Die Voltage Validation ............................................................................. 43
2.14 AGTL+ FSB Specifications................................................................................... 43
Mechanical Specifications............................................................................................. 47
3.1
3.1
Signal Definitions ....................................................................................................... 79
5.1
5.1
Thermal Specifications ................................................................................................ 87
6.1
6.1
Package Thermal Specifications........................................................................... 87
6.1.1
6.1.1
Thermal Specifications ............................................................................ 87
Thermal Metrology ................................................................................. 97