Bungard COTHERM 2,2 W/MK 1X 35#M CU 150X250X1,5 161156E38 Manual De Usuario
Los códigos de productos
161156E38
Bungard Presensitized Base Material
Manual
page 2 / 4
Etching
Enter pcb into the etching machine (recommended etchant:
ferric chloride). With the Bungard JET etching time is approx.
90s for 35µm copper in fresh, warm etchant. With a good layout
a line resolution better than 100 microns is easily achieved.
After etching, rinse pcb and dry thoroughly with paper towels or
air.
Enter pcb into the etching machine (recommended etchant:
ferric chloride). With the Bungard JET etching time is approx.
90s for 35µm copper in fresh, warm etchant. With a good layout
a line resolution better than 100 microns is easily achieved.
After etching, rinse pcb and dry thoroughly with paper towels or
air.
Stripping
After etching, the resist may stay on the copper. You can solder
through the resist. If you want to chemically tin the board, or
apply solder mask, you need to remove the photoresist, though.
Use acetone or alcohol for that. Another, very gentle and
economical way is to expose the pcb again completely and
develop one more time (in the already used developer).
Bungard photoresist as soldermask
The fact that the photoresist can be exposed and developed
several times, can also be used for selectively removing the
resist from solder pads. This way you combine perfect
solderability on the pads with protection of the copper by the
remaining photoresist on the conductor tracks.
Step 1: Etch your ORIGINAL BUNGARD PCB as usual.
Step 2: Expose and develop the positive photoresist after
etching again, this time using a negative film leaving only your
solder pads free.
Step 3: Now tin the open solder pads with BUNGARD SUR-TIN
(chemical tin).
The photoresist remains on all conductor tracks and protects
them. It also serves as a thin solder mask.
After etching, the resist may stay on the copper. You can solder
through the resist. If you want to chemically tin the board, or
apply solder mask, you need to remove the photoresist, though.
Use acetone or alcohol for that. Another, very gentle and
economical way is to expose the pcb again completely and
develop one more time (in the already used developer).
Bungard photoresist as soldermask
The fact that the photoresist can be exposed and developed
several times, can also be used for selectively removing the
resist from solder pads. This way you combine perfect
solderability on the pads with protection of the copper by the
remaining photoresist on the conductor tracks.
Step 1: Etch your ORIGINAL BUNGARD PCB as usual.
Step 2: Expose and develop the positive photoresist after
etching again, this time using a negative film leaving only your
solder pads free.
Step 3: Now tin the open solder pads with BUNGARD SUR-TIN
(chemical tin).
The photoresist remains on all conductor tracks and protects
them. It also serves as a thin solder mask.
This approach is not widely known, but also leads to excellent
results at no extra cost!
results at no extra cost!
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/5036, Fax: +49 (0) 2292/6175, E-mail: support@bungard.de