STMicroelectronics TRANSIL 600W 100V SM6T100CA DO-214AA STM SM6T100CA Hoja De Datos
Los códigos de productos
SM6T100CA
SM6T
Characteristics
Doc ID 3082 Rev 9
5/10
Figure 6.
Capacitance versus reverse
applied voltage for unidirectional
types (typical values)
applied voltage for unidirectional
types (typical values)
Figure 7.
Capacitance versus reverse applied
voltage for bidirectional types
(typical values)
voltage for bidirectional types
(typical values)
C (pF)
10
100
1000
10000
1
10
100
1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8A
SM6T15A
SM6T30A
SM6T68A
SM6T100A
SM6T220A
V
(V)
R
C (pF)
10
100
1000
10000
1
10
100
1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8CA
SM6T15CA
SM6T30CA
SM6T68CA
SM6T100CA
SM6T220CA
V
(V)
R
Figure 8.
Peak forward voltage drop versus
peak forward current
(typical values)
peak forward current
(typical values)
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
impedance junction to ambient
versus pulse duration
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I
FM
(A)
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
Printed circuit board FR4, copper thickness = 35 µm
s
tp
Figure 10.
Thermal resistance junction to
ambient versus copper surface
under each lead
ambient versus copper surface
under each lead
Figure 11.
Leakage current versus junction
temperature (typical values)
temperature (typical values)
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a)
(°C/W)
(printed circuit board FR4,
copper thickness = 35 µm)
copper thickness = 35 µm)
S
Cu
(cm²)
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25
50
75
100
125
150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
< 10 V
T (° C)
j