Texas Instruments bq51013AEVM-764 Integrated Wireless Power Receiver Solution, Qi Evaluation Module (WCSP Package) BQ510 BQ51013AEVM-764 Hoja De Datos
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BQ51013AEVM-764
bq51013AEVM-764 Assembly Drawings and Layout
Buried vias and 0.4 mm pitch routing can be avoided by using the RHL (QFN) package. An example
layout is shown in
layout is shown in
:
Figure 11.
It is also recommended to place vias directly underneath the QFN power-pad to optimize thermal flow to
the GND copper.
the GND copper.
8
bq51013AEVM-764 Assembly Drawings and Layout
The following figures (
through
) show the design of the bq51013AEVM-764 printed-
circuit board (PCB). The EVM has been designed using a 2-layer, 2-oz, copper-clad PCB, 2.1-in. × 2.1-in.
area to provide the user easy viewing, probing, and evaluating of the bq51013A IC in a practical double-
sided application. Moving components to both sides of the PCB or using additional internal layers can
offer additional size reduction for space-constrained systems.
area to provide the user easy viewing, probing, and evaluating of the bq51013A IC in a practical double-
sided application. Moving components to both sides of the PCB or using additional internal layers can
offer additional size reduction for space-constrained systems.
15
SLUU910B – April 2012 – Revised October 2012
bq51013AEVM-764 Evaluation Module (WCSP Package)
Copyright © 2012, Texas Instruments Incorporated