STMicroelectronics M93C66-WMN6P Memory IC M93C66-WMN6P Hoja De Datos
Los códigos de productos
M93C66-WMN6P
DocID4997 Rev 15
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x
Package mechanical data
32
Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 21. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
Symbol
millimeters
inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ
Min
Max
Typ
Min
Max
A
-
-
1.200
-
-
0.0472
A1
-
0.050
0.150
-
0.0020
0.0059
A2
1.000
0.800
1.050
0.0394
0.0315
0.0413
b
-
0.190
0.300
-
0.0075
0.0118
c
-
0.090
0.200
-
0.0035
0.0079
CP
-
-
0.100
-
-
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
-
-
0.0256
-
-
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
-
-
0.0394
-
-
-
0°
8°
-
0°
8°
N
8
8
TSSOP8AM
1
8
CP
c
L
E
E1
D
A2
A
a
e
b
4
5
A1
L1