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Microchip Technology DM163025-1 Hoja De Datos

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 2012 Microchip Technology Inc.
DS30684A-page 463
PIC18(L)F2X/45K50
D015
Comparators
7
7
18
A
1.8V
LP mode
7
7
18
A
3.0V
7
7
18
A
2.3V
7
7
18
A
3.0V
8
8
20
A
5.0V
D16
Comparators
38
38
95
A
1.8V
HP mode
40
40
105
A
3.0V
39
39
95
A
2.3V
40
40
105
A
3.0V
40
40
105
A
5.0V
D017
DAC
12
12
22
A
1.8V
20
20
35
A
3.0V
15
15
30
A
2.3V
20
20
35
A
3.0V
32
32
60
A
5.0V
D018
FVR
(2)
15
16
25
A
1.8V
15
16
25
A
3.0V
28
28
45
A
2.3V
31
31
55
A
3.0V
66
66
100
A
5.0V
D013
A/D Converter
(3)
185
185
370
A
1.8V
A/D on, not converting
210
210
400
A
3.0V
200
200
380
A
2.3V
210
210
400
A
3.0V
250
250
450
A
5.0V
29.2
DC Characteristics: Power-Down Current, PIC18(L)F2X/45K50 (Continued)
 PIC18LF2X/45K50
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C 
 T
A
 
 +85°C
 PIC18F2X/45K50
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C 
 T
A
 
 +85°C
Param 
No.
Device Characteristics
Typ
+25°C
Typ
+60°C
Max 
+85°C
Units
Conditions
V
DD
Notes
Note 1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is 
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD
 or V
SS
 
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2:
On LF devices, the BOR, HLVD and FVR enable internal band gap reference. With more than one of these 
modules enabled, the current consumption will be less than the sum of the specifications. On F devices, 
the internal band gap reference is always enabled and its current consumption is included in the Power-
down Base Current (I
PD
).
3:
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the 
FRC turn off as soon as conversion (if any) is complete.