Analog Devices ADP1614 Evaluation Board ADP1614-1.3-EVALZ ADP1614-1.3-EVALZ Hoja De Datos
Los códigos de productos
ADP1614-1.3-EVALZ
UG-437
Evaluation Board User Guide
Rev. 0 | Page 4 of 8
EVALUATION BOARD SCHEMATIC AND LAYOUT
8
3
9
10
6
2
1
5
VIN
EN
CLRES
SS
SW
SW
FB
COMP
L1
SW
VIN
R1
R2
D1
VOUT
GND
EN
4
GND
GND
EP
11
7
ADP1614
(U1)
ADP1614ACPZ-650-R7
ADP1614ACPZ-1.3-R7
C
IN3
(C6)
C
IN2
(C5)
C
IN1
(C4)
R
CL
(R4)
C
SS
(C1)
R
COMP
(R3)
C
COMP1
(C3)
C
COMP2
(C2)
C
OUT1
(C7)
C
OUT2
(C8)
C
OUT9
(C9)
10859-
005
Figure 5.
Boost Application Evaluation Board Schematic
10859-
006
Figure 6.
Boost Application Printed Circuit Board (PCB) Top Layer
10859-
007
Figure 7.
Boost Application PCB Bottom Layer
LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well-designed
PCB layout is required.
When designing PCBs, use the following guidelines:
• Keep the low ESR input capacitor (C
PCB layout is required.
When designing PCBs, use the following guidelines:
• Keep the low ESR input capacitor (C
IN
) close to the VIN and
GND pins. This minimizes noise injected into the part
from the board parasitic inductance.
from the board parasitic inductance.
• Keep the high current path from C
IN
through the L1 inductor
to the SW and GND pins as short as possible.
• Keep the high current path from the VIN pin through L1,
the rectifier (D1), and the output capacitor (C
OUT
) as short
as possible.
• Keep high current traces as short and as wide as possible.
• Place the feedback resistors, R1 and R2, as close to the FB
• Place the feedback resistors, R1 and R2, as close to the FB
pin as possible to prevent noise pickup. Connect the ground of
the feedback network directly to an AGND plane to make a
Kelvin connection to the GND pin.
the feedback network directly to an AGND plane to make a
Kelvin connection to the GND pin.
• Place the compensation components as close as possible to
the COMP pin. Connect the ground of the compensation
network directly to an AGND plane that makes a Kelvin
connection to the GND pin.
network directly to an AGND plane that makes a Kelvin
connection to the GND pin.
• Avoid routing high impedance traces from the compensation
and feedback resistors near any node connected to SW or
near the inductor to prevent radiated noise injection.
near the inductor to prevent radiated noise injection.
• Connect the soft start capacitor (C
SS
) as close to the device as
possible. Connect the ground of the soft start capacitor to an
AGND plane that makes a Kelvin connection to the GND pin.
AGND plane that makes a Kelvin connection to the GND pin.
• Connect the current limit set resistor (R
CL
) as close as possible
to the device. Connect the ground of R
CL
to an AGND plane
that makes a Kelvin connection to the GND pin.
• The PCB must be properly designed to conduct the heat away
from the package. This is achieved by adding thermal vias to
the PCB that provide a thermal path to the inner or bottom
layers. Place thermal vias on the PCB under the exposed
pad of the LFCSP and in the GND plane around the
the PCB that provide a thermal path to the inner or bottom
layers. Place thermal vias on the PCB under the exposed
pad of the LFCSP and in the GND plane around the
package to improve thermal performance of the application.