Embedded Artists LPCXPRESSO PROTOTYPE BOARD EA-XPR-020 EA-XPR-020 Hoja De Datos
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EA-XPR-020
LPCXpresso Prototype Board - User’s Guide
Page 15
Copyright 2012 © Embedded Artists AB
3.4.4
50 mil Pitch SOIC Components
The two red rectangles in Figure 11 indicate prototype areas for 50 mil pitch SOIC components. The
SOIC components can have 3.9mm, 5.3mm or 7.5mm (300 mil) wide bodies. Each pad is accessible
via a small hole.
Figure 11 – 50 mil SOIC Areas
In-between the SOIC pads, there are 0603-sides pads for decoupling capacitors. The upper pad on all
positions is connected to GND-potential. The lower pod is not connected to anything. It is supposed to
connect to any power supply pin on a SOIC package.
Figure 12 – 0603 pads in SOIC Area
Pad for 0603-sized
capacitor – mount what is
needed for decoupling.
capacitor – mount what is
needed for decoupling.
Not connected pad – shall
be connected to VCC/VDD
of SOIC component to
decouple.
be connected to VCC/VDD
of SOIC component to
decouple.
Upper pad on all positions
is connected to GND.
is connected to GND.