Atmel SAM4S-XPLD Atmel ATSAM4S-XPLD ATSAM4S-XPLD Hoja De Datos
Los códigos de productos
ATSAM4S-XPLD
1091
SAM4S [DATASHEET]
11100E–ATARM–24-Jul-13
Figure 44-2. 100-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 44-4. TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land
Diameter 450
μm
Soldering Mask Opening
350
μm
Table 44-5. Device and 100-ball TFBGA Package Maximum Weight
SAM4S
141
mg
Table 44-6. 100-ball TFBGA Package Characteristics
Moisture Sensitivity Level
3
100-ball TFBGA Package Reference
JEDEC Drawing Reference
MO-275-DDAC-1
JESD97 Classification
e8