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SAM4S [DATASHEET]
11100E–ATARM–24-Jul-13
44.1
Soldering Profile 
Note:
The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
44.2
Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern Standards
Atmel Green and RoHS Policy and Package Material Declaration Data Sheet 
Table 44-24. Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
°C/sec. max.
Preheat Temperature 175°C 
±
 25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
°C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
°C
Ramp-down Rate
6
°C/sec. max.
Time 25
°C to Peak Temperature
8 min. max.