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RJ80530MY650256
Mobile Intel
®
Celeron
®
Processor (0.18µ) in BGA2 and Micro-PGA2 Packages
283654-003 Datasheet
59
6. Thermal
Specifications
This chapter provides needed data for designing a thermal solution. The mobile Intel Celeron
processor is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package
with the back of the processor die exposed and has a specified operational junction temperature
(T
processor is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package
with the back of the processor die exposed and has a specified operational junction temperature
(T
J
) limit.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 32. Mobile Intel Celeron Processor Power Specifications
Symbol Parameter TDP
Typ
1,3
TDP Max
2,3
P
SGNT
3,4
P
QS
3,5
P
DSLP
3,6
Unit
Power
at 500 MHz & 1.10V
at 600 MHz & 1.10V
at 600 MHz & 1.15V
at 400A MHz & 1.35V
at 500 MHz & 1.35V
at 600 MHz & 1.35V
at 450 MHz & 1.60V
at 500 MHz & 1.60V
at 550 MHz & 1.60V
at 600 MHz & 1.60V
at 650 MHz & 1.60V
at 700 MHz & 1.60V
at 750 MHz & 1.60V
at 800 MHz & 1.60V
at 850 MHz & 1.60V
at 900 MHz & 1.70V
at 600 MHz & 1.10V
at 600 MHz & 1.15V
at 400A MHz & 1.35V
at 500 MHz & 1.35V
at 600 MHz & 1.35V
at 450 MHz & 1.60V
at 500 MHz & 1.60V
at 550 MHz & 1.60V
at 600 MHz & 1.60V
at 650 MHz & 1.60V
at 700 MHz & 1.60V
at 750 MHz & 1.60V
at 800 MHz & 1.60V
at 850 MHz & 1.60V
at 900 MHz & 1.70V
5.0
6.4
7.0
6.5
7.9
8.7
6.4
7.0
6.5
7.9
8.7
10.2
11.2
11.9
13.0
14.0
15.0
15.8
17.6
18.8
24.0
11.2
11.9
13.0
14.0
15.0
15.8
17.6
18.8
24.0
8.1
9.7
9.7
9.7
9.7
10.1
12.2
14.4
15.5
16.8
18.4
20.0
21.5
23.0
24.6
25.9
27.5
30.7
12.2
14.4
15.5
16.8
18.4
20.0
21.5
23.0
24.6
25.9
27.5
30.7
0.8
0.8
0.7
1.1
1.1
1.1
1.7
1.7
1.7
1.7
1.7
2.7
2.7
0.8
0.7
1.1
1.1
1.1
1.7
1.7
1.7
1.7
1.7
2.7
2.7
2.51
2.51
2.51
2.9
0.6
0.6
0.5
0.8
0.8
0.8
1.3
1.3
1.3
1.3
1.3
1.9
1.9
0.6
0.5
0.8
0.8
0.8
1.3
1.3
1.3
1.3
1.3
1.9
1.9
1.76
1.76
1.76
2.2
0.2
0.2
0.3
0.3
0.3
0.3
0.5
0.5
0.5
0.5
0.5
0.2
0.3
0.3
0.3
0.3
0.5
0.5
0.5
0.5
0.5
0.75
0.75
0.87
0.87
0.93
0.75
0.87
0.87
0.93
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
T
J
Junction Temperature is
measured with the on-die
thermal diode
measured with the on-die
thermal diode
100 100 50
50
35
°C
NOTES:
1.
TDPTYP is a recommendation based on the power dissipation of the processor while executing publicly
available software under normal operating conditions at nominal voltages. Not 100% tested.
available software under normal operating conditions at nominal voltages. Not 100% tested.
2.
TDPMAX is a specification of the total power dissipation of the processor while executing a worst-case
instruction mix under normal operating conditions at nominal voltages. It includes the power dissipated by
all of the components within the processor. Not 100% tested. Specified by design/characterization.
instruction mix under normal operating conditions at nominal voltages. It includes the power dissipated by
all of the components within the processor. Not 100% tested. Specified by design/characterization.
3.
Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
at higher temperatures and extrapolating the values for the temperature indicated.
4.
PSGNT is Stop Grant and Auto Halt power.
5.
PQS is Quick Start and Sleep power.
6.
PDSLP is Deep Sleep power.
Table 32 provides the maximum Thermal Design Power (TDP
MAX
) dissipation and the minimum
and maximum T
J
temperatures for the mobile Intel Celeron processor. A thermal solution should
be designed to ensure the junction temperature never exceeds these specifications. If no closed
loop thermal failsafe mechanism (processor throttling) is present to maintain T
loop thermal failsafe mechanism (processor throttling) is present to maintain T
J
within
specification then the thermal solution should be designed to cool the TDP
MAX
condition. If a
thermal failsafe mechanism is present then thermal solution could possibly be designed to a
typical Thermal Design Power (TDP
typical Thermal Design Power (TDP
TYP
). TDP
TYP
is a thermal design power recommendation
based on the power dissipation of the processor while executing publicly available software under