Intel 4 HT 631 80552PG0802M2M Hoja De Datos

Intel

Los códigos de productos

80552PG0802M2M

4

Datasheet

THERMTRIP# Signal ................................................................................82

and Fan Speed Reduction ...........................................................82

Thermal Diode........................................................................................82

..............................................................................................................85

Power-On Configuration Options ..........................................................................85

Clock Control and Low Power States.....................................................................85
6.2.1

Normal State .........................................................................................86

HALT and Enhanced HALT Powerdown States..............................................86
6.2.2.1

HALT Powerdown State ..............................................................86

Enhanced HALT Powerdown State................................................87

Stop Grant State ....................................................................................87

Enhanced HALT Snoop or HALT Snoop State,

Stop Grant Snoop State...........................................................................88
6.2.4.1

HALT Snoop State, Stop Grant Snoop State ..................................88

Enhanced HALT Snoop State .......................................................88

Boxed Processor Specifications

........................................................................89

Mechanical Specifications....................................................................................89
7.1.1

Boxed Processor Cooling Solution Dimensions.............................................89

Boxed Processor Fan Heatsink Weight .......................................................91

Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly...............................................................................91

Electrical Requirements ......................................................................................91
7.2.1

Fan Heatsink Power Supply ......................................................................91

Thermal Specifications........................................................................................93
7.3.1

Boxed Processor Cooling Requirements......................................................93

Balanced Technology Extended (BTX) Boxed Processor Specifications

Mechanical Specifications....................................................................................96
8.1.1

Balanced Technology Extended (BTX) Type I and

Type II Boxed Processor Cooling Solution Dimensions..................................96

Boxed Processor Thermal Module Assembly Weight .....................................98

Boxed Processor Support and Retention Module (SRM) ................................98

Electrical Requirements ......................................................................................99
8.2.1

Thermal Module Assembly Power Supply....................................................99

Thermal Specifications...................................................................................... 101
8.3.1

Boxed Processor Cooling Requirements.................................................... 101

Variable Speed Fan ............................................................................... 102

Debug Tools Specifications

..............................................................................105

Logic Analyzer Interface (LAI) ........................................................................... 105
9.1.1

Mechanical Considerations ..................................................................... 105

Electrical Considerations ........................................................................ 105