Kingston Technology 2GB 1333MHz DDR3 ECC CL9 DIMM with Thermal Sensor KVR1333D3E9S/2G Hoja De Datos
Los códigos de productos
KVR1333D3E9S/2G
KVR1333D3E9S/2G
2GB 2Rx8 256M x 72-Bit PC3-10600
CL9 ECC 240-Pin DIMM
CL9 ECC 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 256M x 72-bit (2GB)
DDR3-1333 CL9 SDRAM (Synchronous DRAM), 2Rx8 ECC
memory module, based on eighteen 128M x 8-bit DDR3-1333
FBGA components. The SPD is programmed to JEDEC stan-
dard latency DDR3-1333 timing of 9-9-9 at 1.5V. This 240-pin
DIMM uses gold contact fingers. The electrical and mechanical
specifications are as follows:
FEATURES
•
JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
•
VDDQ = 1.5V (1.425V ~ 1.575V)
•
667MHz fCK for 1333Mb/sec/pin
•
8 independent internal bank
•
Programmable CAS Latency: 9, 8, 7, 6
•
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
•
8-bit pre-fetch
•
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•
Bi-directional Differential Data Strobe
•
Internal(self) calibration: Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•
On Die Termination using ODT pin
•
On-DIMM thermal sensor (Grade B)
•
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
•
Asynchronous Reset
•
PCB: Height 1.18” (30mm), double sided component
Document No. VALUERAM0738-001.B00 08/23/11 Page 1
Memory Module Specifi cations
*Power will vary depending on the SDRAM used.
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
49.5ns (min.)
Refresh to Active/Refresh
110ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
36ns (min.)
Power (Operating)
2.025 W*
UL Rating
94 V - 0
Operating Temperature
0
o
C to 85
o
C
Storage Temperature
-55
o
C to +100
o
C
Continued >>
Important Information: The module defined in this data sheet is one of several configurations available under
this part number. While all configurations are compatible, the DRAM combination and/or the module height may
vary from what is described here.
this part number. While all configurations are compatible, the DRAM combination and/or the module height may
vary from what is described here.