Samsung ML-2015/XEV Manual De Usuario
Service Manual
Reference Information
11-2
Samsung Electronics
11.2 Acronyms and Abbreviations(1)
The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations
or acronyms are used in the text please refer to this table.
or acronyms are used in the text please refer to this table.
Abbreviations
Explanation
AP
Access Point
AC
Alternating Current
APC
Auto Power Control
ASIC
Application Specific Integrated Circuit
ASSY
assembly
BIOS
Basic Input Output System
BLDC
Brush-less Direct Current
CMOS
Complementary Metal Oxide Semiconductor
CN
connector
CON
connector
CPU
Central Processing Unit
dB
decibel
dbA
decibel A
dBM
decibel milliwatt
DC
direct current
DCU
Diagnostic Control Unit
DPI
Dot Per Inch
DRAM
Dynamic Random Access Memory
DVM
Digital Voltmeter
ECP
Enhanced Capability Port
EDC
Embedded Diagnostic control
EEPROM
Electronically Erasable Programmable Read Only Memory
EMI
Electro Magnetic Interference
EP
electrophotographic
EPP
Enhanced Parallel Port
FPOT
First Printout Time
F/W
firmware
GDI
graphics device interface
GND
ground
HBP
Host Based Printing
HDD
Hard Disk Drive
H/H
High temperature and high marshy place
HV
high voltage
HVPS
High Voltage Power Supply
I/F
interface
I/O
Input and Output
IC
integrated circuit
IDE
Intelligent Drive electronics or Imbedded Drive Electronics