Philips BGY280 Manual De Usuario
2000 Nov 15
9
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY280
PACKAGE OUTLINE SOT559A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
00-01-31
00-09-28
00-09-28
IEC
JEDEC
EIAJ
SOT559A
0
5
10 mm
scale
Leadless surface mounted package; plastic cap; 16 terminations
SOT559A
A
c
E1
D
1
2
3
11
12
13
14
15
16
10
9
4
5
6
7
8
D1
E
e1
L (12
×)
b (12
×)
L1 (4×)
e2
e2
e
e
e1
pin 1 index
UNIT
mm
1.1
0.9
0.9
3.5
3.3
3.3
1.9
1.5
1.5
2.6
4.4
b
b1
2.9
2.7
2.7
b2
DIMENSIONS (mm are the original dimensions)
A
5.275
5.075
5.075
b3
4.2
4.0
4.0
b4
1.2
1.0
1.0
b5
0.625
0.425
0.425
b6
0.8
0.6
0.6
b7
0.9
0.7
0.7
b8
14.05
13.45
13.45
D
0.55
0.45
0.45
c
13.6
13.3
13.3
D1
11.3
10.7
10.7
E
e
3.3
e1
10.85
10.55
10.55
1.1
0.9
0.9
E1
e2
L
2.6
2.4
2.4
Z
1.6
1.4
1.4
L1
2.5
2.3
2.3
Z1
0.6
0.4
0.4
L2
1.6
1.4
1.4
L3
3.5
3.3
3.3
Z2
2.9
2.7
2.7
Z3
1.1
0.9
0.9
Z4
1.5
1.3
1.3
Z5
1.1
0.9
0.9
Z6
3.8
3.6
3.6
Z7
1.5
1.3
1.3
Z8
Z (2
×)
Z1 (2×)
L3 (4×)
Z5
(4
×)
b6 (4×)
b1 (2×)
b5 (4×)
b3 (4×)
b8 (4×)
b7 (4×)
b4
(4
×)
b2
(2
×)
Z4 (12×)
Z6 (12×)
Z2 (2×)
Dimensions solderresist
L2
(4
×)
Z8 (6×)
Z7 (6×)
Z3
(2
×)