Hoja De Datos (JM80547PG0722MM)Tabla de contenidos1 Introduction111.1 Terminology121.1.1 Processor Packaging Terminology131.2 References142 Electrical Specifications152.1 FSB and GTLREF152.2 Power and Ground Lands152.3 Decoupling Guidelines152.3.1 VCC Decoupling162.3.2 FSB GTL+ Decoupling162.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking162.4 Voltage Identification172.4.1 Phase Lock Loop (PLL) Power and Filter192.5 Reserved, Unused, FC, and TESTHI Signals202.6 FSB Signal Groups202.7 GTL+ Asynchronous Signals222.8 Test Access Port (TAP) Connection222.9 FSB Frequency Select Signals (BSEL[2:0])232.10 Absolute Maximum and Minimum Ratings232.11 Processor DC Specifications242.12 VCC Overshoot Specification332.12.1 Die Voltage Validation332.13 GTL+ FSB Specifications343 Package Mechanical Specifications353.1 Package Mechanical Drawing353.2 Processor Component Keep-Out Zones393.3 Package Loading Specifications393.4 Package Handling Guidelines393.5 Package Insertion Specifications403.6 Processor Mass Specification403.7 Processor Materials403.8 Processor Markings403.9 Processor Land Coordinates414 Land Listing and Signal Descriptions434.1 Processor Land Assignments434.2 Alphabetical Signals Reference665 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology795.2 Processor Thermal Features795.2.1 Thermal Monitor795.2.2 Thermal Monitor 2805.2.3 On-Demand Mode825.2.4 PROCHOT# Signal825.2.5 THERMTRIP# Signal835.2.6 TCONTROL and Fan Speed Reduction835.2.7 Thermal Diode836 Features856.1 Power-On Configuration Options856.2 Clock Control and Low Power States866.2.1 Normal State866.2.2 HALT and Enhanced HALT Powerdown States876.2.2.1 HALT Powerdown State876.2.2.2 Enhanced HALT Powerdown State886.2.3 Stop-Grant State886.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State886.2.5 HALT Snoop State, Grant Snoop State896.2.5.1 Enhanced HALT Snoop State896.2.6 Enhanced Intel SpeedStep® Technology897 Boxed Processor Specifications917.1 Mechanical Specifications927.1.1 Boxed Processor Cooling Solution Dimensions927.1.2 Boxed Processor Fan Heatsink Weight937.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly937.2 Electrical Requirements937.2.1 Fan Heatsink Power Supply937.3 Thermal Specifications957.3.1 Boxed Processor Cooling Requirements957.3.2 Variable Speed Fan968 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications998.1 Mechanical Specifications1008.1.1 Cooling Solution Dimensions1008.1.2 Boxed Processor Fan Heatsink Weight1008.1.3 Boxed Processor Support and Retention Module (SRM)1018.2 Electrical Requirements1018.2.1 Fan Heatsink Power Supply1018.3 Thermal Specifications1038.3.1 Boxed Processor Cooling Requirements1038.3.2 Variable Speed Fan104Tamaño: 3 MBPáginas: 105Language: EnglishManuales abiertas