Hoja De DatosTabla de contenidosFeatures1Applications1General Description1Package Type1Typical Applications21.0 Electrical Characteristics3Absolute Maximum Ratings32.0 Typical Performance Curves5FIGURE 2-1: 2.0V VOUT Efficiency vs. IOUT.5FIGURE 2-2: 3.3V VOUT Efficiency vs. IOUT.5FIGURE 2-3: 5.0V VOUT Efficiency vs. IOUT.5FIGURE 2-4: 12V VOUT Efficiency vs. IOUT.5FIGURE 2-5: 15V VOUT Efficiency vs. IOUT.5FIGURE 2-6: Input Quiescent Current vs. Temperature.5FIGURE 2-7: Switching Frequency vs. Temperature; VOUT = 3.3V.6FIGURE 2-8: Maximum Duty Cycle vs. Ambient Temperature; VOUT = 5.0V.6FIGURE 2-9: Peak Current Limit vs. Temperature; VOUT = 3.3V.6FIGURE 2-10: Switch RDSON vs. VBOOST.6FIGURE 2-11: VFB vs. Temperature; VOUT = 3.3V.6FIGURE 2-12: Undervoltage Lockout vs. Temperature.6FIGURE 2-13: EN Threshold Voltage vs. Temperature.7FIGURE 2-14: Light Load Switching Waveforms.7FIGURE 2-15: Heavy Load Switching Waveforms.7FIGURE 2-16: Typical Minimum Input Voltage vs. Output Current.7FIGURE 2-17: Startup From Enable.7FIGURE 2-18: Startup From VIN.7FIGURE 2-19: Load Transient Response.8FIGURE 2-20: Line Transient Response.83.0 Pin Descriptions9TABLE 3-1: Pin Function Table93.1 Boost Pin (BOOST)93.2 Ground Pin (GND)93.3 Feedback Voltage Pin (VFB)93.4 Enable Pin (EN)93.5 Power Supply Input Voltage Pin (VIN)93.6 Switch Pin (SW)94.0 Detailed Description114.1 Device Overview114.1.1 Internal Reference Voltage (VREF)114.1.2 Internal Compensation114.1.3 External Components114.1.4 Enable Input114.1.5 Soft Start114.1.6 Undervoltage Lockout114.1.7 Overtemperature Protection11FIGURE 4-1: MCP16301/H Block Diagram.124.2 Functional Description124.2.1 Step-Down or Buck Converter12FIGURE 4-2: Step-Down Converter.134.2.2 Peak Current Mode Control134.2.3 Pulse-Width Modulation (PWM)134.2.4 High-Side Drive134.2.5 Alternative Boost Bias13FIGURE 4-3: Shunt and External Boost Supply.14EQUATION 4-1: Boost Current14EQUATION 4-2: Shunt Resistance15FIGURE 4-4: Series Regulator Boost Supply.155.0 Application Information175.1 Typical Applications175.2 Adjustable Output Voltage Calculations175.3 General Design Equations17EQUATION 5-2: Continuous Inductor Current Duty Cycle17TABLE 5-1: Recommended Inductor Values175.4 Input Capacitor Selection185.5 Output Capacitor Selection18TABLE 5-2: Capacitor Value Range185.6 Inductor Selection18EQUATION 5-4: Inductor Ripple Current18EQUATION 5-5: Inductor Peak Current18TABLE 5-3: MCP16301/H Recommended 3.3V Inductors195.7 Freewheeling Diode19EQUATION 5-6: Diode Average Current19TABLE 5-4: Freewheeling Diodes195.8 Boost Diode195.9 Boost Capacitor205.10 Thermal Calculations20EQUATION 5-7: Total Power Dissipation Estimate20EQUATION 5-8: Diode Power Dissipation Estimate205.11 PCB Layout Information20FIGURE 5-1: MCP16301/H SOT-23-6 Recommended Layout, 600 mA Design.21FIGURE 5-2: MCP16301/H SOT-23-6 D2 Recommended Layout, 200 mA Design.226.0 Typical Application Circuits23FIGURE 6-1: Typical Application 30V VIN to 3.3V VOUT.23FIGURE 6-2: Typical Application 15V – 30V Input; 12V Output.24FIGURE 6-3: Typical Application 12V Input; 2V Output at 600 mA.25FIGURE 6-4: Typical Application 10V to 16V VIN to 2.5V VOUT.26FIGURE 6-5: Typical Application 4V to 30V VIN to 3.3V VOUT at 150 mA.277.0 Packaging Information297.1 Package Marking Information29Appendix A: Revision History35Product Identification System36Trademarks37Worldwide Sales and Service38Tamaño: 800 KBPáginas: 38Language: EnglishManuales abiertas
Manual De UsuarioTabla de contenidosTrademarks21.1 Introduction91.2 MCP16301 Short Overview91.3 What is the MCP16301 300 mA D2PAK Demo Board?101.4 What DOES the MCP16301 300 mA D2PAK Demo Board kit Contain?102.1 Introduction112.1.1 MCP16301 Features112.1.2 MCP16301 300 mA D2PAK Demo Board Features112.2 Getting Started122.2.1 Power Input and Output Connection122.2.1.1 POWERING THE MCP16301 300 mA D2PAK Demo Board122.2.1.2 Board Testing122.2.2 How the MCP16301 300 mA D2PAK Demo Board Boost Strap Operates12A.1 Introduction13A.2 Board – Schematic14A.3 Board – Top Silk and Pads15A.4 Board – Top Copper Layer15A.5 Board – Bottom Copper Layer16Table B-1: Bill of MAterials (BOM)17Corporate Office18Atlanta18Boston18Chicago18Cleveland18Fax: 216-447-064318Dallas18Detroit18Indianapolis18Toronto18Fax: 852-2401-343118Australia - Sydney18China - Beijing18China - Shanghai18India - Bangalore18Korea - Daegu18Korea - Seoul18Singapore18Taiwan - Taipei18Fax: 43-7242-2244-39318Denmark - Copenhagen18France - Paris18Germany - Munich18Italy - Milan18Spain - Madrid18UK - Wokingham18Worldwide Sales and Service18Worldwide Sales and Service18Tamaño: 400 KBPáginas: 18Language: EnglishManuales abiertas
