Microchip Technology IC MCU OTP 4K PIC16C74B-20/L PLCC-44 MCP Manuales de usuario

Tabla de contenidos

• 1.0 General Description

  5
  • 1.1 Family and Upward Compatibility

    5
  • 1.2 Development Support

    5
• 2.0 PIC16C63A/65B/73B/74B Device Varieties

  7
  • 2.1 UV Erasable Devices

    7
  • 2.2 One-Time-Programmable (OTP) Devices

    7
  • 2.3 Quick-Turnaround-Production (QTP) Devices

    7
  • 2.4 Serialized Quick-Turnaround Production (SQTPSM) Devices

    7
• 3.0 Architectural Overview

  9
  • 3.1 Clocking Scheme/Instruction Cycle

    14
  • 3.2 Instruction Flow/Pipelining

    14
• 4.0 Memory Organization

  15
  • 4.1 Program Memory Organization

    15
  • 4.2 Data Memory Organization

    15
    • 4.2.1 General purpose Register File

      15
    • 4.2.2 Special Function Registers

      16
      • 4.2.2.1 STATUS Register

        19
      • 4.2.2.2 OPTION Register

        20
      • 4.2.2.3 INTCON Register

        21
      • 4.2.2.4 PIE1 Register

        22
      • 4.2.2.5 PIR1 Register

        23
      • 4.2.2.6 PIE2 Register

        24
      • 4.2.2.7 PIR2 Register

        24
      • 4.2.2.8 PCON Register

        25
  • 4.3 PCL and PCLATH

    26
    • 4.3.1 computed GOTO

      26
    • 4.3.2 Stack

      26
  • 4.4 Program Memory Paging

    26
  • 4.5 Indirect Addressing, INDF and FSR Registers

    27
• 5.0 I/O Ports

  29
  • 5.1 PORTA and TRISA Registers

    29
  • 5.2 PORTB and TRISB Registers

    31
  • 5.3 PORTC and TRISC Registers

    33
  • 5.4 PORTD and TRISD Registers

    34
  • 5.5 PORTE and TRISE Register

    35
  • 5.6 Parallel Slave Port (PSP)

    37
• 6.0 Timer0 Module

  39
  • 6.1 Timer0 Interrupt

    39
  • 6.2 Using Timer0 with an External Clock

    40
  • 6.3 Prescaler

    40
• 7.0 Timer1 Module

  43
  • 7.1 Timer1 Operation in Timer Mode

    44
  • 7.2 Timer1 Operation in Synchronized Counter Mode

    44
  • 7.3 Timer1 Operation in Asynchronous Counter Mode

    45
    • 7.3.1 Reading and writing Timer1 in asynchronous counter mode

      45
  • 7.4 Timer1 Oscillator

    45
  • 7.5 Resetting Timer1 using a CCP Trigger Output

    45
  • 7.6 Resetting of Timer1 Register Pair (TMR1H, TMR1L)

    45
  • 7.7 Timer1 Prescaler

    45
• 8.0 Timer2 Module

  47
  • 8.1 Timer2 Prescaler and Postscaler

    47
  • 8.2 Output of TMR2

    47
• 9.0 Capture/Compare/PWM ModuleS

  49
  • 9.1 Capture Mode

    51
    • 9.1.1 CCP pin Configuration

      51
    • 9.1.2 Timer1 Mode Selection

      51
    • 9.1.3 Software Interrupt

      51
    • 9.1.4 CCP Prescaler

      51
  • 9.2 Compare Mode

    52
    • 9.2.1 CCP Pin Configuration

      52
    • 9.2.2 timer1 Mode Selection

      52
    • 9.2.3 Software Interrupt Mode

      52
    • 9.2.4 Special Event Trigger

      52
  • 9.3 PWM Mode (PWM)

    52
    • 9.3.1 PWM period

      53
    • 9.3.2 PWM Duty Cycle

      53
    • 9.3.3 Set-Up for PWM Operation

      53
• 10.0 Synchronous Serial Port (SSP) Module

  55
  • 10.1 SSP Module Overview

    55
  • 10.2 SPI Mode

    55
  • 10.3 SSP I2C Operation

    60
    • 10.3.1 SLAVE Mode

      60
      • 10.3.1.1 Addressing

        61
      • 10.3.1.2 Reception

        62
      • 10.3.1.3 Transmission

        63
    • 10.3.2 Master Mode

      64
    • 10.3.3 Multi-master Mode

      64
• 11.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART)

  65
  • 11.1.1 SAMPLING

    67
  • 11.2.1 USART Asynchronous Transmitter

    68
  • 11.2.2 USART Asynchronous Receiver

    70
  • 11.2.4 USART Synchronous Master Transmission

    72
  • 11.3.1 USART Synchronous Slave Transmit

    76
• 12.0 Analog-to-Digital Converter (A/D) Module

  79
  • 12.1 A/D Acquisition Requirements

    82
  • 12.2 Selecting the A/D Conversion Clock

    83
  • 12.3 Configuring Analog Port Pins

    83
  • 12.4 A/D Conversions

    83
  • 12.5 A/D Operation During SLEEP

    83
  • 12.6 Effects of a RESET

    83
  • 12.7 Use of the CCP Trigger

    83
• 13.0 Special Features of the CPU

  85
  • 13.1 Configuration Bits

    85
  • 13.2 Oscillator Configurations

    86
    • 13.2.1 Oscillator Types

      86
    • 13.2.2 Crystal Oscillator/CERAmic Resonators

      86
    • 13.2.3 RC Oscillator

      87
  • 13.3 Reset

    88
  • 13.4 ResetS

    89
    • 13.4.1 Power-On Reset (POR)

      89
    • 13.4.2 Power-up Timer (PWRT)

      89
    • 13.4.3 Oscillator Start-up Timer (OST)

      89
    • 13.4.4 Brown-Out Reset (BOR)

      89
    • 13.4.5 Time-out Sequence

      89
    • 13.4.6 Power Control/Status Register (PCON)

      89
  • 13.5 Interrupts

    93
    • 13.5.1 INT Interrupt

      94
    • 13.5.2 TMR0 Interrupt

      94
    • 13.5.3 PortB INTERRUPT-ON-CHANGE

      94
  • 13.6 Context Saving During Interrupts

    95
  • 13.7 Watchdog Timer (WDT)

    95
    • 13.7.1 WDT Period

      95
    • 13.7.2 WDT Programming Considerations

      96
  • 13.8 Power-down Mode (SLEEP)

    97
    • 13.8.1 Wake-up from SLEEP

      97
    • 13.8.2 Wake-Up Using Interrupts

      97
  • 13.9 Program Verification/Code Protection

    98
  • 13.10 ID Locations

    98
  • 13.11 In-Circuit Serial Programming

    98
• 14.0 Instruction Set Summary

  99
  • 14.1 Instruction Descriptions

    101
• 15.0 Development Support

  107
  • 15.1 MPLAB Integrated Development Environment Software

    107
  • 15.2 MPASM Assembler

    107
  • 15.3 MPLAB C17 and MPLAB C18 C Compilers

    107
  • 15.4 MPLINK Object Linker/ MPLIB Object Librarian

    108
  • 15.5 MPLAB SIM Software Simulator

    108
  • 15.6 MPLAB ICE High Performance Universal In-Circuit Emulator with MPLAB IDE

    108
  • 15.7 ICEPIC In-Circuit Emulator

    108
  • 15.8 MPLAB ICD In-Circuit Debugger

    109
  • 15.9 PRO MATE II Universal Device Programmer

    109
  • 15.10 PICSTART Plus Entry Level Development Programmer

    109
  • 15.11 PICDEM 1 Low Cost PIC MCU Demonstration Board

    109
  • 15.12 PICDEM 2 Low Cost PIC16CXX Demonstration Board

    109
  • 15.13 PICDEM 3 Low Cost PIC16CXXX Demonstration Board

    110
  • 15.14 PICDEM 17 Demonstration Board

    110
  • 15.15 KeeLoq Evaluation and Programming Tools

    110
• 16.0 Electrical Characteristics

  113
  • 16.1 DC Characteristics

    116
  • 16.2 AC (Timing) Characteristics

    122
    • 16.2.1 Timing Parameter Symbology

      122
    • 16.2.2 Timing Conditions

      123
    • 16.2.3 Timing Diagrams and Specifications

      124
• 17.0 DC and AC Characteristics Graphs and Tables

  139
• 18.0 Packaging Information

  153
  • 18.1 Package Marking Information

    153
  • 18.2 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)

    155
  • 18.3 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)

    156
  • 18.4 28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

    157
  • 18.5 28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)

    158
  • 18.6 40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)

    159
  • 18.7 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)

    160
  • 18.8 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

    161
  • 18.9 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP)

    162
  • 18.10 44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)

    163
• Index

  169
  • A

    169
  • B

    169
  • C

    169
  • D

    170
  • E

    170
  • F

    170
  • G

    170
  • I

    170
  • K

    170
  • L

    170
  • M

    170
  • O

    171
  • P

    171
  • R

    172
  • S

    172
  • T

    172
  • U

    173
  • W

    173
  • Z

    173
  • The Microchip Web Site

    175
  • Customer Change Notification Service

    175
  • Customer Support

    175
  • Reader Response

    176
    • Corporate Office

      186
    • Atlanta

      186
    • Boston

      186
    • Chicago

      186
    • Cleveland

      186
    • Fax: 216-447-0643

      186
    • Dallas

      186
    • Detroit

      186
    • Indianapolis

      186
    • Toronto

      186
    • Fax: 852-2401-3431

      186
    • Australia - Sydney

      186
    • China - Beijing

      186
    • China - Shanghai

      186
    • India - Bangalore

      186
    • Korea - Daegu

      186
    • Korea - Seoul

      186
    • Singapore

      186
    • Taiwan - Taipei

      186
    • Fax: 43-7242-2244-393

      186
    • Denmark - Copenhagen

      186
    • France - Paris

      186
    • Germany - Munich

      186
    • Italy - Milan

      186
    • Spain - Madrid

      186
    • UK - Wokingham

      186
    • Worldwide Sales and Service

      186