Hoja De DatosTabla de contenidos1.0 Device Overview31.1 Applications4TABLE 1-1: Overview of Features4FIGURE 1-1: SYSTEM BLOCK DIAGRAM4TABLE 1-2: Pin Descriptions5TABLE 1-3: MCP2150 Signal Direction62.0 Device Operation72.1 Power Up72.2 Device Reset72.3 Clock Source7FIGURE 2-1: Crystal Operation (or Ceramic Resonator)7TABLE 2-1: Capacitor Selection for Ceramic Resonators7TABLE 2-2: Capacitor Selection for Crystal Oscillator7FIGURE 2-2: External Clock Input Operation72.4 Bit Clock82.5 UART Interface8TABLE 2-3: Serial Baud Rate Selection vs. Frequency82.6 Modulation92.7 Demodulation9FIGURE 2-3: Encoding9FIGURE 2-4: Decoding92.8 Minimizing Power102.9 Network Layering Reference Model10FIGURE 2-5: ISO Reference Layer Model10FIGURE 2-6: IrDA Data - Protocol Stacks11FIGURE 2-7: IrDA Standard Protocol Layers12FIGURE 2-8: IrLAP Frame12FIGURE 2-9: IrCOMM Service Classes13FIGURE 2-10: Connection Sequence172.10 Operation18TABLE 2-4: Theoretical Irda STANDARD THROUGHPUT EXAMPLES @ 115.2 KBAUD182.11 Turnaround Latency192.12 IR Port Baud Rate192.13 Programmable Device ID19TABLE 2-5: DTR/RTS State & device mode19FIGURE 2-11: ID String Format192.14 Optical Transceiver22FIGURE 2-12: Typical Optical Transceiver Circuit222.15 References22TABLE 2-6: Common Optical Transceiver Manufacturers223.0 development tools23FIGURE 3-1: MCP2150 Developer’s Kit Block Diagram234.0 Electrical Characteristics25FIGURE 4-1: Voltage-Frequency Graph, -40°C £ Ta £ +85°C264.1 DC Characteristics274.1 DC Characteristics (Continued)284.1 DC Characteristics (Continued)294.2 Timing Parameter Symbology and Load Conditions30TABLE 4-1: Symbology30TABLE 4-2: AC Temperature and Voltage Specifications30FIGURE 4-2: Load Conditions for Device Timing Specifications304.3 Timing Diagrams and Specifications31FIGURE 4-3: External Clock Timing31TABLE 4-3: External Clock Timing Requirements31FIGURE 4-4: Output Waveform32TABLE 4-4: Output Timing Requirements32FIGURE 4-5: RESET and Device Reset Timing33TABLE 4-5: Reset and Device Reset Requirements33FIGURE 4-6: UART Asynchronous Transmission Waveform34TABLE 4-6: UART ASynchronous Transmission Requirements34FIGURE 4-7: UART Asynchronous Receive Timing35TABLE 4-7: UART ASynchronous Receive Requirements35FIGURE 4-8: TXIR Waveforms36TABLE 4-8: TXIR Requirements36FIGURE 4-9: RXIR Waveforms37TABLE 4-9: RXIR Requirements375.0 DC and AC Characteristics Graphs and Tables396.0 Packaging Information416.1 Package Marking Information41The Microchip Web Site47Customer Change Notification Service47Customer Support47Reader Response48Corporate Office52Atlanta52Boston52Chicago52Cleveland52Fax: 216-447-064352Dallas52Detroit52Indianapolis52Toronto52Fax: 852-2401-343152Australia - Sydney52China - Beijing52China - Shanghai52India - Bangalore52Korea - Daegu52Korea - Seoul52Singapore52Taiwan - Taipei52Fax: 43-7242-2244-39352Denmark - Copenhagen52France - Paris52Germany - Munich52Italy - Milan52Spain - Madrid52UK - Wokingham52Worldwide Sales and Service52Tamaño: 1000 KBPáginas: 52Language: EnglishManuales abiertas
Hoja De DatosTabla de contenidosPreface5Introduction5Document Layout6Conventions Used in this Guide7Recommended Reading8The Microchip Web Site8Customer Support8Document Revision History9Chapter 1. Product Overview111.1 Introduction And Highlights111.2 What is the MCP2150 Developer’s Board?111.3 MCP2150 Developer’s Board Features121.4 PC Requirements171.5 What the MCP2150 Developer’s Board Kit includes17Chapter 2. Installation and Operation192.1 Introduction192.2 The Demo System202.3 MCP2150DM Demos21Appendix A. Schematic and Layouts35A.1 Introduction35A.2 Board - Schematic - Page 136A.3 Board - Schematic - Page 237A.4 Board - Top Silk and Pads38A.5 Board - Top Layer39A.6 Board - Top Layer with Silk and Pads40A.7 Board - Bottom Layer41A.8 Board - Power Layer42A.9 Board - Ground Layer43Appendix B. Bill Of Materials (BOM)45Appendix C. Board Testing49C.1 What is Tested49C.2 What is NOT Tested50Appendix D. Configuring the HyperTerminal® Program51D.1 Configuring the Hyperterminal® Program51Appendix E. Continuously Transmitted Data Table61E.1 Data Table for Demo #261Appendix F. Programming the MCP2150DM63Worldwide Sales and Service64Tamaño: 2 MBPáginas: 64Language: EnglishManuales abiertas
