Hoja De DatosTabla de contenidos1.0 Electrical Characteristics32.0 Typical Performance Curves7FIGURE 2-1: Temperature Accuracy.7FIGURE 2-2: Temperature Accuracy Histogram, TA = -40°C to +125°C.7FIGURE 2-3: Temperature Accuracy Histogram, TA = +25°C.7FIGURE 2-4: Temperature Accuracy Histogram, TA = +45°C.7FIGURE 2-5: Temperature Accuracy Histogram, TA = +125°C.7FIGURE 2-6: Temperature Accuracy Histogram, TA = -40°C.7FIGURE 2-7: Supply Current vs. Temperature.8FIGURE 2-8: Shutdown Current vs. Temperature.8FIGURE 2-9: Power-on Reset Threshold Voltage vs. Temperature.8FIGURE 2-10: Temperature Accuracy vs. Supply Voltage.8FIGURE 2-11: Power Supply Rejection vs. Frequency.8FIGURE 2-12: Temperature Conversion Time vs. Temperature.8FIGURE 2-13: SDA and Alert Output VOL vs. Temperature.9FIGURE 2-14: SDA IOL vs. Temperature.9FIGURE 2-15: Package Thermal Response.9FIGURE 2-16: SMBus Time-out vs. Temperature.93.0 Pin Description11TABLE 3-1: Pin Function Table113.1 Address Pins (A0, A1, A2)11TABLE 3-2: MCP9804 Address Byte113.2 Ground Pin (GND)113.3 Serial Data Line (SDA)113.4 Serial Clock Line (SCL)113.5 Temperature Alert, Open-Drain Output (Alert)113.6 Power Pin (VDD)113.7 Exposed Thermal Pad (EP)114.0 Serial Communication134.1 2-Wire Standard Mode I2C™ Protocol Compatible Interface13TABLE 4-1: MCP9804 Serial Bus protocol descriptions13FIGURE 4-1: Device Addressing.145.0 Functional Description15FIGURE 5-1: Functional Block Diagram.155.1 Registers16TABLE 5-1: Bit Assignment Summary for all registers (See Section 5.3 “Summary of Power-on Default” for Power-on Defaults)17FIGURE 5-2: Timing Diagram for Writing to the Configuration Register (see Section 4.0 “Serial Communication”).20FIGURE 5-3: Timing Diagram for Reading from the Configuration Register (see Section 4.0 “Serial Communication”).21FIGURE 5-4: Timing Diagram for Writing and Reading from the TUPPER Register (see Section 4.0 “Serial Communication”).23FIGURE 5-5: Timing Diagram for Reading +25.25°C Temperature from the TA Register (see Section 4.0 “Serial Communication”).26FIGURE 5-6: Timing Diagram for Reading the Manufacturer ID Register (see Section 4.0 “Serial Communication”).27FIGURE 5-7: Timing Diagram for Reading Device ID and Device Revision Register (see Section 4.0 “Serial Communication”).28FIGURE 5-8: Timing Diagram for Changing TA Resolution to +0.0625°C <0000 0011>b (see Section 4.0 “Serial Communication”).295.2 Sensor Feature Description30FIGURE 5-9: Active-Low Alert Output Configuration.30TABLE 5-2: Temperature Conversion Time31FIGURE 5-10: Alert Output Conditions.325.3 Summary of Power-on Default33TABLE 5-3: Power-ON Reset defaults336.0 Applications Information356.1 Layout Considerations356.2 Thermal Considerations35FIGURE 6-1: DFN Package Layout (Top View).357.0 Packaging Information377.1 Package Marking Information37Trademarks51Worldwide Sales and Service52Tamaño: 1 MBPáginas: 52Language: EnglishManuales abiertas
Hoja De DatosTabla de contenidos1.0 Electrical Characteristics31.1 Absolute Maximum Ratings†31.2 Electrical Specifications32.0 Typical Performance Curves7FIGURE 2-1: INL vs. Supply Voltage (VDD).7FIGURE 2-2: INL vs. Temperature.7FIGURE 2-3: Offset Error vs. Temperature.7FIGURE 2-4: Output Noise vs. Input Voltage.7FIGURE 2-5: Total Error vs. Input Voltage.7FIGURE 2-6: Gain Error vs. Temperature.7FIGURE 2-7: IDDA vs. Temperature.8FIGURE 2-8: IDDS vs. Temperature.8FIGURE 2-9: IDDB vs. Temperature.8FIGURE 2-10: OSC Drift vs. Temperature.8FIGURE 2-11: Frequency Response.83.0 Pin Descriptions9TABLE 3-1: PIN Function Table93.1 Analog Inputs (VIN+, VIN-)93.2 Supply Voltage (VDD, VSS)93.3 Serial Clock Pin (SCL)93.4 Serial Data Pin (SDA)10FIGURE 3-1: Equivalent Analog Input Circuit.104.0 Description of Device Operation114.1 General Overview114.2 Power-On-Reset (POR)11FIGURE 4-1: POR Operation.114.3 Internal Voltage Reference114.4 Analog Input Channel114.5 Input Voltage Range124.6 Input Impedance124.7 Aliasing and Anti-aliasing Filter124.8 Self-Calibration124.9 Digital Output Codes and Conversion to Real Values13TABLE 4-1: Resolution Settings VS. LSB13TABLE 4-2: Example of output code for 18 bits (Note 1,Note 2)13TABLE 4-3: Minimum and Maximum Output codes (Note)13TABLE 4-4: Example of converting output code to voltage (With 18 Bit Setting)145.0 Using the MCP3421 Device155.1 Operating Modes155.2 Configuration Register16TABLE 5-1: Write Configuration Bits17TABLE 5-2: READ Configuration Bits175.3 I2C Serial Communications17FIGURE 5-1: MCP3421 Address Byte.18FIGURE 5-2: Timing Diagram For Writing To The MCP3421.18TABLE 5-3: Output Codes of each Resolution OPTION19FIGURE 5-3: iming Diagram For Reading From The MCP3421 With 18-Bit Mode.20FIGURE 5-4: Timing Diagram For Reading From The MCP3421 With 12-Bit to 16-Bit Modes.215.4 General Call22FIGURE 5-5: General Call Address Format.225.5 High-Speed (HS) Mode225.6 I2C Bus Characteristics22FIGURE 5-6: Data Transfer Sequence on I2C Serial Bus.23TABLE 5-4: I2c serial timing Specifications24FIGURE 5-7: I2C Bus Timing Data.266.0 Basic Application Configuration276.1 Connecting to the Application Circuits27FIGURE 6-1: Typical Connection Example.27FIGURE 6-2: Example of Multiple Device Connection on I2C Bus.27FIGURE 6-3: I2C Bus Communications Test.28FIGURE 6-4: Differential and Single- Ended Input Connections.286.2 Application Examples29FIGURE 6-5: Battery Voltage Measurement.29FIGURE 6-6: Battery Current Measurement.29FIGURE 6-7: Example of Pressure Measurement.30FIGURE 6-8: Simple Signal Conditioning Design with Asymmetric Circuit.30FIGURE 6-9: High Performance Signal Conditioning Design with Symmetric Circuit.30FIGURE 6-10: Example of Temperature Measurement.317.0 Development Tool Support337.1 MCP3421 Evaluation Boards33FIGURE 7-1: MCP3421 Evaluation Board.33FIGURE 7-2: Setup for the MCP3421 Evaluation Board with PICkit™ Serial Analyzer.33FIGURE 7-3: Example of PICkit™ Serial User Interface.348.0 Packaging Information358.1 Package Marking Information35Tamaño: 700 KBPáginas: 42Language: EnglishManuales abiertas
Hoja De DatosTabla de contenidosPreface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading7The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 What is the Thermocouple Reference Design?91.3 What the Thermocouple Reference Design kit includes9Chapter 2. Installation and Operation112.1 Introduction112.2 Features112.3 Getting Started12Appendix A. Schematic and Layouts17A.1 Introduction17A.2 Board - Schematic18A.3 Board -Top Silk and Pads19A.4 Board - Internal VDD Layer19A.5 Board - Internal Ground Layer20A.6 Board - Bottom Silk and Pads20Appendix B. Bill of Materials21Corporate Office22Atlanta22Boston22Chicago22Cleveland22Fax: 216-447-064322Dallas22Detroit22Kokomo22Toronto22Fax: 852-2401-343122Australia - Sydney22China - Beijing22China - Shanghai22India - Bangalore22Korea - Daegu22Korea - Seoul22Singapore22Taiwan - Taipei22Fax: 43-7242-2244-39322Denmark - Copenhagen22France - Paris22Germany - Munich22Italy - Milan22Spain - Madrid22UK - Wokingham22Worldwide Sales and Service22Tamaño: 400 KBPáginas: 22Language: EnglishManuales abiertas
